Datasheet

Package information SMP50 / SMTPA / TPA
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Figure 13. Footprint, dimensions in mm (inches)
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 7. SMB dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 1.95 2.20 0.077 0.087
c 0.15 0.40 0.006 0.016
E 5.10 5.60 0.201 0.220
E1 4.05 4.60 0.159 0.181
D 3.30 3.95 0.130 0.156
L 0.75 1.50 0.030 0.059
Table 8. DO-15 dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 6.05 6.75 0.238 0.266
B 2.95 3.53 0.116 0.139
C 26 31 1.024 1.220
D 0.71 0.88 0.028 0.035
E
C
L
E1
D
A1
A2
b
2.60
5.84
1.62
2.18
1.62
(0.064) (0.102)
(0.300)
(0.064)
(0.086)
D
B
A
CC