Datasheet

SMP75 Characteristics
Doc ID 5015 Rev 5 5/9
Figure 6. Relative variation of breakover
voltage versus junction
temperature
Figure 7. Relative variation of leakage
current versus reverse voltage
applied (typical values)
V [Tj] / V [Tj=25°C]
BO BO
0.94
0.95
0.96
0.97
0.98
0.99
1.00
1.01
1.02
1.03
1.04
1.05
1.06
1.07
1.08
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 110 120 130
Tj(°C)
1
10
100
1000
10000
25 50 75 100 125
I [Tj] / I [Tj=25°C]
RR
Tj(°C)
Figure 8. Variation of thermal impedance
junction to ambient versus pulse
duration
Figure 9. Relative variation of junction
capacitance versus reverse voltage
applied (typical values)
Z/R
th(j-a) th(j-a)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
tp(s)
Printed circuit board FR4,
copper thickness = 35 µm,
recommended pad layout
C [V ] / C [V =2V]
RR
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1 10
V (V)
R
F =1MHz
V = 1V
Tj = 25°C
OSC RMS