Datasheet
Table Of Contents
- 1 Characteristics
- Table 1. Absolute ratings (Tamb = 25 C)
- Table 2. Thermal resistances
- Table 3. Electrical characteristics - parameter definitions (Tamb = 25 C)
- Table 4. Electrical characteristics - parameter values (Tamb = 25 C)
- Figure 1. Definition of IPP pulse
- Figure 2. Peak power dissipation versus initial junction temperature
- Figure 3. Peak pulse power versus exponential pulse duration (Tj initial = 25 C)
- Figure 4. Clamping voltage versus peak pulse current (exponential waveform, maximum values)
- Figure 5. Junction capacitance versus reverse applied voltage (typical values)
- Figure 6. Peak forward voltage drop versus peak forward current (typical values)
- Figure 7. Relative variation of thermal impedance junction to ambient versus pulse duration (printed ciruit board FR4, SCu = 1 cm2)
- Figure 8. Thermal resistance junction to ambient versus copper surface under each lead (printed circuit board FR4, eCu = 35 µm)
- Figure 9. Leakage current versus junction temperature (typical values)
- 2 Ordering information scheme
- 3 Package information
- 4 Ordering information
- 5 Revision history
SMM4F Ordering information
9/10
4 Ordering information
5 Revision history
Table 7. Ordering information
Order code
(1)
1. xx indicates stand-off voltage
Marking Package Weight Base qty Delivery mode
SMM4FxxA-TR See Table 6. STmite flat 16.7 mg 12000 Tape and reel
Table 8. Document revision history
Date Revision Changes
29-Nov-2007 1 First issue.
19-Dec-2007 2 Updated I
PP
and R
D
parameters in columns 10 and 11 of Ta bl e 4 .