Datasheet

SMM4F Characteristics
5/10
Figure 9. Leakage current versus junction temperature (typical values)
Figure 5. Junction capacitance versus
reverse applied voltage (typical
values)
Figure 6. Peak forward voltage drop versus
peak forward current (typical
values)
10
100
1000
10000
1 10 100
F=1 MHz
V
OSC
=30 mV
RMS
T
j
=25 °C
SMM4F5.0A
SMM4F15A
SMM4F24A
SMM4F33A
C(pF)
V (V)
R
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
0.0 0.5 1.0 1.5 2.0 2.5 3.0
T
j
=25 °C
T
j
=125 °C
I (A)
FM
V (V)
FM
Figure 7. Relative variation of thermal
impedance junction to ambient
versus pulse duration (printed
ciruit board FR4, S
Cu
= 1 cm
2
)
Figure 8. Thermal resistance junction to
ambient versus copper surface
under each lead (printed circuit
board FR4, e
Cu
= 35 µm)
0.00
0.01
0.10
1.00
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03
On recommended pad
layout
Z
th(j-a)
/R
th(j-a)
t (S)
p
40
60
80
100
120
140
160
180
200
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
R
th(j-a)
(°C/W)
S (cm )
CU
2
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
25 50 75 100 125 150 175
V
R
=V
RM
V
BR
≤11.7V
V
BR
>11.7V
T (°C)
j
I (nA)
R