Datasheet
Table Of Contents
- 1 Characteristics
- Table 1. Absolute ratings (Tamb = 25 C)
- Table 2. Thermal resistances
- Table 3. Electrical characteristics - parameter definitions (Tamb = 25 C)
- Table 4. Electrical characteristics - parameter values (Tamb = 25 C)
- Figure 1. Definition of IPP pulse
- Figure 2. Peak power dissipation versus initial junction temperature
- Figure 3. Peak pulse power versus exponential pulse duration (Tj initial = 25 C)
- Figure 4. Clamping voltage versus peak pulse current (exponential waveform, maximum values)
- Figure 5. Junction capacitance versus reverse applied voltage (typical values)
- Figure 6. Peak forward voltage drop versus peak forward current (typical values)
- Figure 7. Relative variation of thermal impedance junction to ambient versus pulse duration (printed ciruit board FR4, SCu = 1 cm2)
- Figure 8. Thermal resistance junction to ambient versus copper surface under each lead (printed circuit board FR4, eCu = 35 µm)
- Figure 9. Leakage current versus junction temperature (typical values)
- 2 Ordering information scheme
- 3 Package information
- 4 Ordering information
- 5 Revision history
SMM4F Package information
7/10
3 Package information
● Case: JEDEC DO-222AA molded plastic over Planar junction
● Terminals: Solder plated, solderable per MIL-STD-750, Method 2026
● Polarity: For unidirectional types the band indicates cathode.
● Flammability: Epoxy is rated UL94V-0
● RoHS package
In order to meet environmental requirements, ST (also) offers these devices in ECOPACK®
packages. ECOPACK® packages are Lead-free. The category of second level Interconnect
is marked on the inner box label, in compliance with JEDEC Standard JESD97. The
maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Table 5. STmite flat dimensions
Ref.
Dimensions
Millimeters Inches
Min. Typ. Max. Min. Typ. Max.
A 0.80 0.85 0.95 0.031 0.033 0.037
b 0.40 0.55 0.65 0.016 0.022 0.026
b2 0.70 0.85 1.00 0.027 0.033 0.039
c 0.10 0.15 0.25 0.004 0.006 0.009
D 1.75 1.90 2.05 0.069 0.075 0.081
E 3.60 3.80 3.90 0.142 0.150 0.154
E1 2.80 2.95 3.10 0.110 0.116 0.122
L 0.50 0.55 0.80 0.020 0.022 0.031
L1 2.10 2.40 2.60 0.083 0.094 0.102
L2 0.45 0.60 0.75 0.018 0.024 0.030
L3 0.20 0.35 0.50 0.008 0.014 0.020
Figure 11. STmite flat footprint
dimensions
Figure 12. Marking information
E1
E
c
D
b
L3
A
L
L1
L2
b2
0.85 0.63 2.00
millimeters
(inches)
4.13
0.95
1.95
0.65
0.65
(0.033) (0.079)
(0.037) (0.077)(0.026)
(0.163)
(.025) (.026)
y w w
x x x
XXX: Marking
Y: Year
WW: week
Cathode bar (
unidirectional
devices only )