Datasheet
Table Of Contents
- 1 Characteristics
- Table 1. Absolute ratings (Tamb = 25 C)
- Table 2. Thermal resistances
- Table 3. Electrical characteristics - parameter definitions (Tamb = 25 C)
- Table 4. Electrical characteristics - parameter values (Tamb = 25 C)
- Figure 1. Definition of IPP pulse
- Figure 2. Peak power dissipation versus initial junction temperature
- Figure 3. Peak pulse power versus exponential pulse duration (Tj initial = 25 C)
- Figure 4. Clamping voltage versus peak pulse current (exponential waveform, maximum values)
- Figure 5. Junction capacitance versus reverse applied voltage (typical values)
- Figure 6. Peak forward voltage drop versus peak forward current (typical values)
- Figure 7. Relative variation of thermal impedance junction to ambient versus pulse duration (printed ciruit board FR4, SCu = 1 cm2)
- Figure 8. Thermal resistance junction to ambient versus copper surface under each lead (printed circuit board FR4, eCu = 35 µm)
- Figure 9. Leakage current versus junction temperature (typical values)
- 2 Ordering information scheme
- 3 Package information
- 4 Ordering information
- 5 Revision history
Characteristics SMM4F
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Figure 4. Clamping voltage versus peak pulse current
(exponential waveform, maximum values)
Figure 2. Peak power dissipation versus
initial junction temperature
Figure 3. Peak pulse power versus
exponential pulse duration
(T
j
initial = 25 °C)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
0 25 50 75 100 125 150 175 200
P
PP
[T
j
initial] / P
PP
[T
j
initial
=25°C]
T (°C)
j initial
0.1
1.0
10.0
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01
T
j
initial = 25 °C
t (ms)
p
P (kW)
PP
0
1
10
100
1000
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70
T
j
initial=25 °C
SMM4F33A
SMM4F24A
SMM4F15A
SMM4F5.0A
tp = 8/20 µs
tp = 10/1000 µs
I
PP
(A)
V
CL
(V)