Datasheet
Table Of Contents
- 1 Characteristics
- Table 1. Absolute maximum ratings (Tamb = 25 C)
- Table 2. Thermal resistances
- Figure 1. Electrical characteristics - definitions
- Figure 2. Pulse definition for electrical characteristics
- Table 3. Electrical characteristics - parameter values (Tamb = 25 C)
- Figure 3. Peak pulse power dissipation versus initial junction temperature
- Figure 4. Peak pulse power versus exponential pulse duration (Tj initial = 25 C)
- Figure 5. Clamping voltage versus peak pulse current (exponential waveform, maximum values)
- Figure 6. Junction capacitance versus reverse applied voltage for unidirectional types (typical values)
- Figure 7. Junction capacitance versus reverse applied voltage for bidirectional types (typical values)
- Figure 8. Peak forward voltage drop versus peak forward current (typical values)
- Figure 9. Relative variation of thermal impedance, junction to ambient, versus pulse duration
- Figure 10. Thermal resistance junction to ambient versus copper surface under each lead
- Figure 11. Leakage current versus junction temperature (typical values)
- 2 Ordering information scheme
- 3 Package information
- 4 Ordering information
- 5 Revision history
SMCJ Package information
Doc ID 5617 Rev 8 7/10
3 Package information
● Case: JEDEC DO-214AB molded plastic over planar junction
● Terminals: solder plated, solderable per MIL-STD-750, Method 2026
● Polarity: for unidirectional types the band indicates cathode
● Flammability: epoxy is rated UL94V-0
● RoHS package
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK
®
specifications, grade definitions and product status are available at: www.st.com
.
ECOPACK
®
is an ST trademark.
Table 4. SMC dimensions
Ref.
dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 2.90 3.2 0.114 0.126
c 0.15 0.41 0.006 0.016
E 7.75 8.15 0.305 0.321
E1 6.60 7.15 0.260 0.281
E2 4.40 4.70 0.173 0.185
D 5.55 6.25 0.218 0.246
L 0.75 1.60 0.030 0.063
Figure 13. Footprint dimensions mm
(inches)
Figure 14. Marking layout
(1)
1. Marking layout can vary according to assembly location.
E
C
LE2
E1
D
A1
A2
b
8.19
1.545.111.54
(0.061) (0.201)
(0.322)
(0.124)
(0.061)
3.14
y w w
e
z
x x x
e: ECOPACK compliance
XXX: Marking
Z: Manufacturing location
Y: Year
WW: week
Cathode bar ( unidirectional devices only )