Datasheet

SMCJ Characteristics
Doc ID 5617 Rev 8 5/10
Figure 6. Junction capacitance versus
reverse applied voltage for
unidirectional types (typical values)
Figure 7. Junction capacitance versus
reverse applied voltage for
bidirectional types (typical values)
0.01
0.10
1.00
10.00
1 10 100 1000
C(nF)
F=1 MHz
V
OSC
=30 mV
RMS
T
j
=25 °C
SMCJ5.0A
SMCJ12A
SMCJ24A
SMCJ40A
SMCJ85A
SMCJ188A
V
R
(V)
0.01
0.10
1.00
10.00
1 10 100 1000
C(nF)
F=1 MHz
V
OSC
=30 mV
RMS
T
j
=25 °C
SMCJ5.0CA
SMCJ12CA
SMCJ24CA
SMCJ40CA
SMCJ85CA
SMCJ188CA
V
R
(V)
Figure 8. Peak forward voltage drop
versus peak forward current
(typical values)
Figure 9. Relative variation of thermal
impedance, junction to ambient,
versus pulse duration
Figure 10. Thermal resistance junction to
ambient versus copper surface
under each lead
Figure 11. Leakage current versus junction
temperature (typical values)
I
FM
(A)
1.0E-01
1.0E+00
1.0E+01
1.0E+02
0.0 0.5 1.0 1.5 2.0 2.5 3.0
T
j
=25 °C
T
j
=125 °C
V
FM
(V)
0.01
0.10
1.00
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+03
Z
th(j-a)
/R
th(j-a)
t
P
(s)
Recommended pad layout
PCB FR4, copper thickness = 35 µm
0
10
20
30
40
50
60
70
80
90
100
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R
th(j-a)
(°C/W)
S
CU
(cm²)
PCB FR4, copper thickness = 35 µm
I
R
(nA)
1.0E+00
1.0E+01
1.0E+02
1.0E+03
1.0E+04
25 50 75 100 125 150
V
R
=V
RM
V
RM
≥ 10 V
V
R
=V
RM
V
RM
<10V
T
j
(°C)