Datasheet

SMC30J Characteristics
Doc ID 022064 Rev 1 5/10
Figure 11. Leakage current versus junction temperature (typical values)
Figure 9. Relative variation of thermal
impedance, junction to ambient,
versus pulse duration
Figure 10. Thermal resistance junction to
ambient versus copper surface
under each lead
0.01
0.10
1.00
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
t (s)
p
Recommended pad layout
Single pulse
Z/R
th(j-a) th(j-a)
epoxy printed board, FR4 copper thickness = 35 µm
0
10
20
30
40
50
60
70
80
90
100
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
S (cm )
Cu
2
epoxy printed board, FR4 copper thickness = 35 µm
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
1.E+05
25 50 75 100 125 150
I (nA)
R
V=V
RRM
V < 10 V
RM
V10V
RM
≥
T (°C)
j