Datasheet

SMA4F Characteristics
5/9
Figure 6. Peak forward voltage drop versus
peak forward current (typical
values)
Figure 7. Relative variation of thermal
impedance junction to ambient
versus pulse duration (printed
ciruit board FR4, S
Cu
= 1 cm
2
)
Figure 8. Thermal resistance junction to
ambient versus copper surface
under each lead
(printed circuit board FR4,
copper thickness
= 35 µm)
Figure 9. Leakage current versus junction
temperature (typical values)
I (A)
FM
1.E-02
1.E-01
1.E+00
1.E+01
1.E+02
0.4 0.6 0.8 1.0 1.2 1.4
T
j
=25 °C
T
j
=150 °C
V (V)
FM
Z
th(j-a)
/R
th(j-a)
1.E-03
1.E-02
1.E-01
1.E+00
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
On recommended pad
layout
t (S)
p
R
th(j-a)
(°C/W)
0
20
40
60
80
100
120
140
160
180
200
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
S (cm )
CU
2
I (nA)
R
1.E+01
1.E+02
1.E+03
25 50 75 100 125 150 175
V
R
=V
RM
SMA4F5.0A
T (°C)
j