Datasheet

SM6TY Characteristics
Doc ID 17741 Rev 3 7/12
Figure 10. Junction capacitance versus reverse
applied voltage for unidirectional
types (typical values)
Figure 11. Junction capacitance versus
reverse applied voltage for
bidirectional types (typical values)
C(pF)
10
100
1000
10000
1 10 100 1000
SM6T6V8AY
SM6T30AY
SM6T82AY
F = 1 Mhz
V = 30 mV
T = 25 °C
OSC RMS
j
V (V)
R
100
1000
10000
1 10 100 1000
C(pF)
SM6T6V8CAY
SM6T30CAY
SM6T82CAY
F = 1 Mhz
V = 30 mV
T = 25 °C
OSC RMS
j
V (V)
R
Figure 12. Relative variation of thermal
impedance, junction to ambient,
versus pulse duration
Figure 13. Thermal resistance junction to
ambient versus copper surface
under each lead
Zth (j-a)/Rth (j-a)
0.01
0.10
1.00
1.0E-03 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 1.0E+0
3
Recommended pad layout
Printed circuit board FR4, copper thickness = 35 µm
s
tp
R
th(j-a)
(°C/W)
0
10
20
30
40
50
60
70
80
90
100
110
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Printed circuit board FR4,
copper thickness = 35 µm
S
Cu
(cm²)
Figure 14. Leakage current versus junction
temperature (typical values)
Figure 15. Peak forward voltage drop versus
peak forward current
(typical values)
I
R
(nA)
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
25 50 75 100 125 150
V
R
=V
RM
V
RM
≥ 10 V
V
R
=V
RM
V
RM
< 10 V
T (° C)
j
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
0.0 0.5 1.0 1.5 2.0 2.5 3.0
I
FM
(A)
T
j
=25 °C
T
j
=125 °C
V
FM
(V)