Datasheet

SM4TY Characteristics
Doc ID 17862 Rev 3 5/12
Figure 11. Peak forward voltage drop versus peak forward current (typical values)
Figure 9. Thermal resistance junction to
ambient versus copper surface
under each lead
Figure 10. Leakage current versus junction
temperature (typical values)
0
10
20
30
40
50
60
70
80
90
100
110
120
130
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
S (cm²)
Cu
Printed circuit board FR4,
copper thickness = 35 µm
1.E-01
1.E+00
1.E+01
1.E+02
1.E+03
25 50 75 100 125 150
I (nA)
R
T (°C)
j
V=V
V10V
RRM
RM
≥
V=V
V < 10 V
RRM
RM
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
T = 125 °C
j
I (A)
FM
T = 25 °C
j
V (V)
FM