Datasheet

SM30TY Characteristics
Doc ID 022065 Rev 2 5/13
Figure 11. Thermal resistance junction to ambient versus copper surface under each lead
Figure 9. Peak forward voltage drop versus
peak forward current
(typical values)
Figure 10. Relative variation of thermal
impedance, junction to ambient,
versus pulse duration
I (A)
FM
0.1
1.0
10.0
100.0
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
T = 150 °C
j
T = 25 °C
j
V (V)
FM
Z/R
th(j-a) th(j-a)
0.01
0.10
1.00
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Recommended pad layout
Single pulse
t (s)
p
epoxy printed board, FR4 copper thickness = 35 µm
0
10
20
30
40
50
60
70
80
90
100
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R (°C/W)
th(j-a)
S (cm )
Cu
2
epoxy printed board, FR4 copper thickness = 35 µm