Datasheet

Characteristics SM2T3V3A
2/6 Doc ID 11738 Rev 2
1 Characteristics
Table 1. Absolute rating (limiting value)
Symbol Parameter Value Unit
P
PP
Peak pulse power dissipation
(1)
1. 10/1000 µs pulse waveform
T
j
initial = T
amb
200 W
P Power dissipation on infinite heatsink T
amb
= 100°C 2.5 W
I
FSM
Non repetitive surge peak forward current
t
p
= 10 ms
T
j
initial = T
amb
25 A
T
stg
T
j
Storage temperature range
Maximum operating junction temperature
-65 to +175
150
°C
T
l
Lead solder temperature (10 seconds duration) 260 °C
Table 2. Thermal resistance
Symbol Parameter Value Unit
R
th(j-l)
Junction to leads 20 °C/W
R
th(j-a)
Junction to ambient on PCB with recommended pad layout 250 °C/W
Table 3. Electrical characteristics - parameters (T
amb
= 25 °C)
Symbol Parameter
V
RM
Stand-off voltage.
V
BR
Breakdown voltage.
V
CL
Clamping voltage.
I
RM
Leakage current @ VRM.
I
PP
Peak pulse current.
αT Voltage temperature coefficient
V
F
Forward voltage drop
Table 4. Electrical characteristics - values (T
amb
= 25 °C)
Order
code
I
RM
max @
V
RM
V
BR
min @
I
R
(1)
1. Pulse test t
p
< 50 ms
V
CL
max @ I
PP
10/1000 µs
V
CL
max @ I
PP
10/1000 µs
αT
max
(2)
2. ΔV
BR
= αT * (T
amb
- 25) + V
BR
(25 °C)
C
max
(3)
3. V
R
= 0 V, F = 1 MHz
µAVVmAVAVA
10
-4
/°C
pF
SM2T3V3A 500 3.3 3.6 1 6.5 25 6.8 30 -5.3 2500
I
I
F
V
F
VV
CL
V
BR
V
RM
I
PP
I
RM
V