Datasheet

SM15TY Characteristics
Doc ID 17865 Rev 3 5/12
Figure 11. Relative variation of thermal impedance junction to ambient versus pulse duration
Figure 9. Leakage current versus junction
temperature (typical values)
Figure 10. Peak forward voltage drop versus
peak forward current
(typical values)
I (nA)
R
1.E+00
1.E+01
1.E+02
1.E+03
1.E+04
25 50 75 100 125 150
T (°C)
j
V=V
RRM
V < 10 V
RM
V10V
RM
≥
0.1
1.0
10.0
100.0
0.0 0.5 1.0 1.5 2.0 2.5
V (V)
FM
I (A)
FM
T = 25 °C
j
T = 125 °C
j
0.01
0.10
1.00
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Recommended pad layout
Single pulse
printed circuit board,
copper thickness = 35 µm
Z/R
th(j-a) th(j-a)
t (s)
p