Datasheet

Pin description and connections PM8834
6/20 DocID15086 Rev 3
2.2 Thermal data
Note: Maximum power dissipation and derating factor are estimated assuming 125 °C as
maximum operating junction temperature.
Table 3. Thermal data
Symbol Parameter Value Unit
T
MAX
Maximum junction temperature 150 °C
T
STG
Storage temperature range -40 to 150 °C
T
J
Junction temperature range -40 to 150 °C
T
A
Operating ambient temperature range -40 to 105 °C
SO8
R
THJA
Thermal resistance junction-to-ambient (device soldered
on 2s2p PC board - 67 mm x 67 mm)
85 °C/W
R
THJC
Thermal resistance junction-to-case 40 °C/W
P
TOT
Maximum power dissipation at 70 °C (device soldered on
2s2p PC board - 67 mm x 67 mm)
0.65 W
DF Derating factor above 70 °C 12 mW/°C
MSOP8
R
THJA
Thermal resistance junction-to-ambient (device soldered
on 2s2p PC board - 67 mm x 67 mm)
50 °C/W
R
THJC
Thermal resistance junction-to-case 10 °C/W
P
TOT
Maximum power dissipation at 70 °C (device soldered on
2s2p PC board - 67 mm x 67 mm)
1.1 W
DF Derating factor above 70 °C 20 mW/°C