Datasheet

DocID15086 Rev 3 5/20
PM8834 Pin description and connections
20
2 Pin description and connections
Figure 2. Pin connections (top view)
2.1 Pin description
287B
9&&
287B
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3:0B
*1'
3:0B
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Table 2. Pin description
Pin # Name Function
1 ENABLE_1
Enable input for Driver 1. Pull low to disable Driver 1 (OUT1 will be low,
PWM1 will be ignored). Even though internally pulled up to VCC with a
typ. 100 kΩ resistor, it is recommended to pull high up to VCC to enable
the section.
The pin features TTL/CMOS-compatible thresholds.
2PWM_1
PWM input signal for Driver 1 featuring TTL/CMOS-compatible threshold
and hysteresis. It is internally pulled down to GND with a 10
μ
A current
generator.
3GND
All internal references, logic and drivers are referenced to this pin.
Connect to the PCB ground plane.
4PWM_2
PWM input signal for Driver 2 featuring TTL/CMOS-compatible threshold
and hysteresis. It is internally pulled down to GND with a 10 mA current
generator.
5OUT_2
Driver 2 output. The output stage is capable of providing up to 4 A drive
current to the gate of a power MOSFET. IGBTs are supported as well. A
low ohmic value series resistor can be useful to reduce dissipated power.
6 VCC PM8834 supply voltage. Bypass with low-ESR MLCC capacitor to GND.
7OUT_1
Driver 1 output. The output stage is capable of providing up to 4 A drive
current to the gate of a power MOSFET. IGBTs are supported as well. A
low ohmic value series resistor can be useful to reduce dissipated power.
8 ENABLE_2
Enable input for Driver 2. Pull low to disable Driver 2 (OUT2 will be low,
PWM2 will be ignored). Even though internally pulled up to VCC with a
typ. 100 kΩ
resistor it is recommended to pull high up to VCC to enable
the section.The pin features TTL/CMOS compatible thresholds.
PM8834M only
EXP PAD
The thermal pad connects the silicon substrate and makes good thermal
contact with the PCB. Use multiple vias to connect it to the GND plane.