Datasheet

DocID15086 Rev 3 15/20
PM8834 Design guidelines
20
The combination of a copper pad, copper plane and vias under the driver allows the device
to reach its best thermal performance.
Figure 9. Driver turn-on and turn-off paths
Figure 10. Example of placement of external components - SO8 package
Figure 11. Example of placement of external components - MSOP8 package
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