Datasheet

Package mechanical data M95M01-DF M95M01-R
40/45 Doc ID 13264 Rev 11
Figure 25. M95M01-DFCS6TP/K, WLCSP 8-bump wafer-level chip scale package outline
1. Drawing is not to scale.
(4X)
aaa
Wafer back side
D
E
Side view
Detail A
A2
A
e1
e2
e
G
F
Bumps side
F
Detail A
Rotated 90 °
Bump
eee
A1
Seating plane
1Ce_ME_V1
e3
G
b
bbb
Z
Z
X
ccc M
YØ
Z
Ø
ddd M
X
Y
Z
Z
Reference
Orientation