Datasheet
M95640-W M95640-R M95640-DF Description
Doc ID 16877 Rev 17 7/49
Figure 2. 8-pin package connections (top view)
1. See Section 10: Package mechanical data section for package dimensions, and how to identify pin 1.
Figure 3. 8-bump thin WLCSP connections (top view)
Caution: As EEPROM cells lose their charge (and so their binary value) when exposed to ultra violet
(UV) light, EEPROM dice delivered in wafer form or in WLCSP package by
STMicroelectronics must never be exposed to UV light.
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