Datasheet

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M95640, M95320
REVISION HISTORY
Table 33. Document Revision History
Date Rev. Description of Revision
13-Jul-2000 1.2
Human Body Model meets JEDEC std (Table 2). Minor adjustments on pp 1,11,15. New clause
on p7. Addition of TSSOP8 package on pp 1, 2, Ordering Info, Mechanical Data
16-Mar-2001 1.3
Test condition added I
LI
and I
LO
, and specification of t
DLDH
and t
DHDL
removed.
t
CLCH
, t
CHCL
, t
DLDH
and t
DHDL
changed to 50ns for the -V range.
“-V” Voltage range changed to “2.7V to 3.6V” throughout.
Maximum lead soldering time and temperature conditions updated.
Instruction sequence illustrations updated.
“Bus Master and Memory Devices on the SPI bus” illustration updated.
Package Mechanical data updated
19-Jul-2001 1.4 M95160 and M95080 devices removed to their own data sheet
06-Dec-2001 1.5
Endurance increased to 1M write/erase cycles
Instruction sequence illustrations updated
18-Dec-2001 2.0 Document reformatted using the new template. No parameters changed.
08-Feb-2002 2.1
Announcement made of planned upgrade to 10MHz clock for the 5V, –40 to 85°C, range.
Endurance set to 100K write/erase cycles
18-Dec-2002 2.2
10MHz, 5MHz, 2MHz clock; 5ms, 10ms Write Time; 100K, 1M erase/write cycles distinguished
on front page, and in the DC and AC Characteristics tables
26-Mar-2003 2.3 Process indentification letter corrected in footnote to AC Characteristics table for temp. range 3
26-Jun-2003 2.4 -S voltage range upgraded by removing it and inserting -R voltage range in its place
15-Oct-2003 3.0
Table of contents, and Pb-free options added. V
IL
(min) improved to -0.45V
21-Nov-2003 3.1
V
I
(min) and V
O
(min) corrected (improved) to -0.45V
28-Jan-2004 4.0 TSSOP8 connections added to DIP and SO connections
24-May-2005 5.0
M95320-S and M95640-S root part numbers (1.65 to 5.5V Supply) and related characteristics
added.
20MHz Clock rate added.TSSOP14 package removed and MLP8 package added.
Description of Power On Reset: VCC Lock-Out Write Protect updated.
Product List summary table added. Absolute Maximum Ratings for V
IO
(min) and V
CC
(min)
improved. Soldering temperature information clarified for RoHS compliant devices. Device
Grade 3 clarified, with reference to HRCF and automotive environments. AEC-Q100-002
compliance. t
CHHL
(min) and t
CHHH
(min) is t
CH
for products under “S” process. t
HHQX
corrected
to t
HHQV
.
Figure 17., Hold Timing updated.