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Integrated Circuits (ICs)
TSSOP 8 64 kBit 8 K x 8
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M95640-W M956
40-R M95640-DF
Package mechani
cal data
Doc ID 16877 Rev 17
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Figure 27.
Thin WLCSP 8-b
ump wafer
-length chip
-scale packa
ge
recommended land
pattern
MM
MM
MM
#I?&0?6
MM
X
PP
1
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