Datasheet

DocID11124 Rev 21 45/50
M95512-W M95512-R M95512-DR M95512-DF Package mechanical data
Figure 26. M95512-DFCS6TP/K – WLCSP 8-bump wafer-level chip scale package
outline
1. Drawing is not to scale.
(4X)
aaa
Wafer back side
D
E
Side view
Detail A
A2
A
Bumps side
Detail A
Rotated 90 °
Bump
eee
A1
Seating plane
1Cf_ME_V1
b
bbb
Z
Z
X
ccc M
YØ
Z
Ø
ddd M
X
Y
Z
Z
Reference
e3
e1
G
F
e2
e
Reference