Datasheet

Package mechanical data M95256-W M95256-R M95256-DR M95256-DF
44/52 DocID12276 Rev 20
Figure 26. M95256-DFCS6TP/K, WLCSP 8-bump wafer-level chip scale package outline
1. Drawing is not to scale.
(4X)
aaa
Wafer back side
D
E
Side view
Detail A
A2
A
e1
e2
e
G
F
Bumps side
F
Detail A
Rotated 90 °
Bump
eee
A1
Seating plane
1Cg_ME_V1
e3
b
bbb
Z
Z
X
ccc M
YØ
Z
Ø
ddd M
X
Y
Z
Z
Reference
Orientation
H
Table 25. M95256-DFCS6TP/K, WLCSP 8-bump wafer-level chip scale package
mechanical data
Symbol
millimeters inches
(1)
Typ Min Max Typ Min Max
A 0.540 0.500 0.580 0.0213 0.0197 0.0228
A1 0.190 - - 0.0075 - -
A2 0.350 - - 0.0138 - -
b 0.270 - - 0.0106 - -
D 1.271 - 1.291 0.0500 - 0.0508
E 1.358 - 1.378 0.0535 - 0.0543
e 0.800 - - 0.0315 - -
e1 0.693 - - 0.0273 - -
e2 0.400 - - 0.0157 - -
e3 0.400 - - 0.0157 - -
F 0.333 - - 0.0131 - -
G 0.235 - - 0.0093 - -