Datasheet

DocID12276 Rev 20 43/52
M95256-W M95256-R M95256-DR M95256-DF Package mechanical data
Figure 25. UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat no lead, package
outline
1. Drawing is not to scale.
2. The central pad (area E2 by D2 in the above illustration) is internally pulled to V
SS
. It must not be
connected to any other voltage or signal line on the PCB, for example during the soldering process.
Table 24. UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead
2 x 3 mm, data
Symbol
millimeters inches
(1)
1. Values in inches are converted from mm and rounded to four decimal digits.
Typ Min Max Typ Min Max
A 0.550 0.450 0.600 0.0217 0.0177 0.0236
A1 0.020 0.000 0.050 0.0008 0.0000 0.0020
b 0.250 0.200 0.300 0.0098 0.0079 0.0118
D 2.000 1.900 2.100 0.0787 0.0748 0.0827
D2 (rev MC) - 1.200 1.600 - 0.0472 0.0630
E 3.000 2.900 3.100 0.1181 0.1142 0.1220
E2 (rev MC) - 1.200 1.600 - 0.0472 0.0630
e 0.500 - - 0.0197 - -
K (rev MC) - 0.300 - - 0.0118 -
L - 0.300 0.500 - 0.0118 0.0197
L1 - - 0.150 - - 0.0059
L3 - 0.300 - - 0.0118 -
eee
(2)
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle
from measuring.
- 0.080 - - 0.0031 -
D
E
ZW_MEeV2
A
A1
eee
L1
e b
D2
L
E2
L3
Pin 1
K