Datasheet

DocID12276 Rev 20 51/52
M95256-W M95256-R M95256-DR M95256-DF Revision history
21-Jun-2012 18
Datasheet split into:
– M95256-125 datasheet for automotive products (range 3),
– M95256-W, M95256-R, M95256-DR, M95256-DF (this datasheet) for
standard products (range 6).
Added:
– 1.7 V device (M95256-DF)
Updated:
– Figure 4: Block diagram
– Table 25: M95256-DFCS6TP/K, WLCSP 8-bump wafer-level chip scale
package mechanical data and Figure 26: M95256-DFCS6TP/K,
WLCSP 8-bump wafer-level chip scale package outline
– Cycling and data retention values (Table 14 and Table 15)
Deleted:
– UFDFPN8 package rev MB
24-Jul-2012 19
Updated:
– WLCSP package reference from “CT” to “CS”
– Figure 3: WLCSP connections (top view, marking side, with bumps on
the underside)
– Figure 26: M95256-DFCS6TP/K, WLCSP 8-bump wafer-level chip scale
package outline
09-Apr-2013 20
Document reformatted.
Updated:
– Package figure on cover page
– Section 7.2: Initial delivery state
– Note
(1)
in Table 8: Absolute maximum ratings
Deleted note 1 in Table 21: AC characteristics (M95256-DF, device grade
6).
Replaced “ball” by “bump” in the entire document.
Table 27. Document revision history (continued)
Date Revision Changes