Datasheet

Package mechanical data M95160 M95160-W M95160-R M95160-DF
44/47 DocID022580 Rev 4
Figure 26. WLCSP-R–1.350 x 1.365 mm 0.4 mm pitch 8 bumps, package outline
1. Primary datum Z and seating plane are defined by the spherical crowns of the bump.
2. Drawing is not to scale.
3. Preliminary data.
Table 24. WLCSP-R – 1.350 x 1.365 mm 0.4 mm pitch 8 bumps, package mechanical
data (preliminary data)
Symbol
millimeters inches
(1)
1. Values in inches are converted from mm and rounded to four decimal digits.
Typ Min Max Typ Min Max
A 0.545 0.490 0.600 0.0193 0.0215 0.0236
A1 0.190 - - 0.0075 - -
A2 0.355 - - 0.014 - -
b
(2)
2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.
0.270 0.240 0.300 0.0106 0.0094 0.0118
D 1.350 - 1.475 0.0531 - 0.0581
E 1.365 - 1.490 0.0537 - 0.0587
e 0.400 - - 0.0157 - -
e1 0.800 - - 0.0315 - -
F 0.282 - - 0.0111 - -
G 0.275 - - 0.0108 - -
N (total number of
terminals)
88
aaa 0.110 0.0043
eee 0.060 0.0024
(4X)
aaa
X
Y
WAFER BACK SIDE
D
E
SIDE VIEW
Z
bbb
Detail A
A2
A
e1
e2
e
G
F
BUMP SIDE
Pin 1 corner
H
e3
F
DETAIL A
ROTATED 90 °
BUMP
Z
eee
Øccc M
Øddd M
Z
ZX Y
Øb


Z
A1
Seating plane

1C_ME