Datasheet

Package mechanical data M93C86-x M93C76-R M93C66-x M93C56-x M93C46-x

28/33 DocID4997 Rev 15

Figure 15. UFDFPN8 8-lead Ultra thin Fine pitch Dual Flat Package No lead

2 x 3 mm, outline

1. Drawing is not to scale.

2. The central pad (area E2 by D2 in the above illustration) is pulled, internally, to V

. It must not be allowed

to be connected to any other voltage or signal line on the PCB, for example during the soldering process.

3. The circle in the top view of the package indicates the position of pin 1.

Table 20. UFDFPN8 8-lead Ultra thin Fine pitch Dual Flat Package No lead

x 3 mm, data

Symbol

millimeters inches

(1)

1. Values in inches are converted from mm and rounded to four decimal digits.

Typ Min Max Typ Min Max

A 0.550 0.450 0.600 0.0217 0.0177 0.0236

A1 0.020 0.000 0.050 0.0008 0.0000 0.0020

b 0.250 0.200 0.300 0.0098 0.0079 0.0118

D 2.000 1.900 2.100 0.0787 0.0748 0.0827

D2 (rev MC) - 1.200 1.600 - 0.0472 0.0630

E 3.000 2.900 3.100 0.1181 0.1142 0.1220

E2 (rev MC) - 1.200 1.600 - 0.0472 0.0630

e 0.500 - - 0.0197 - -

K (rev MC) - 0.300 - - 0.0118 -

L - 0.300 0.500 - 0.0118 0.0197

L1 - - 0.150 - - 0.0059

L3 - 0.300 - - 0.0118 -

eee

(2)

2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from

measuring.

- 0.080 - - 0.0031 -

ZW_MEeV2

eee

e b

Pin 1