Datasheet

ManualsBrandsSTMICROELECTRONICS ManualsIntegrated Circuits (ICs)SO 8 8 kBit 1 K x 8, 512 x 16

1/31October 2005

M93C86, M93C76, M93C66

M93C56, M93C46

16Kbit, 8Kbit, 4Kbit, 2Kbit and 1Kbit (8-bit or 16-bit wide)

MICROWIRE® Serial Access EEPROM

FEATURES SUMMARY

■ Industry Standard MICROWIRE Bus

■ Single Supply Voltage:

– 4.5 to 5.5V for M93Cx6

– 2.5 to 5.5V for M93Cx6-W

– 1.8 to 5.5V for M93Cx6-R

■ Dual Organization: by Word (x16) or Byte (x8)

■ Programming Instructions that work on: Byte,

Word or Entire Memory

■ Self-timed Programming Cycle with Auto-

Erase: 5ms

■ Ready/Busy Signal During Programming

■ 2MHz Clock Rate

■ Sequential Read Operation

■ Enhanced ESD/Latch-Up Behavior

■ More than 1 Million Erase/Write Cycles

■ More than 40 Year Data Retention

■ Packages

– ECOPACK® (RoHS compliant)

Table 1. Product List

Figure 1. Packages

Reference

Part

Number

Reference

Part

Number

M93C86

M93C56

M93C86-W M93C56-W

M93C86-R M93C56-R

M93C76

M93C46

M93C76-W M93C46-W

M93C76-R M93C46-R

M93C66

M93C66-W

M93C66-R

PDIP8 (BN)

SO8 (MN)

150 mil width

TSSOP8 (DW)

169 mil width

TSSOP8 (DS)

3x3mm² body size (MSOP)

UFDFPN8 (MB)

2x3mm² (MLP)

Summary of content (31 pages)

PAGE 1
M93C86, M93C76, M93C66 M93C56, M93C46 16Kbit, 8Kbit, 4Kbit, 2Kbit and 1Kbit (8-bit or 16-bit wide) MICROWIRE® Serial Access EEPROM FEATURES SUMMARY ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Industry Standard MICROWIRE Bus Single Supply Voltage: – 4.5 to 5.5V for M93Cx6 – 2.5 to 5.5V for M93Cx6-W – 1.8 to 5.
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M93C86, M93C76, M93C66, M93C56, M93C46 TABLE OF CONTENTS FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 1. Figure 1. Figure 2. Table 2. Table 3. Table 4. Figure 3. Product List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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M93C86, M93C76, M93C66, M93C56, M93C46 Table 12. AC Measurement Conditions (M93Cx6) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Table 13. AC Measurement Conditions (M93Cx6-W and M93Cx6-R) . . . . . . . . . . . . . . . . . . . . . . 15 Figure 8. AC Testing Input Output Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Table 14. Capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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M93C86, M93C76, M93C66, M93C56, M93C46 SUMMARY DESCRIPTION These electrically erasable programmable memory (EEPROM) devices are accessed through a Serial Data Input (D) and Serial Data Output (Q) using the MICROWIRE bus protocol. In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. ECOPACK® packages are Lead-free and RoHS compliant. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. lect (ORG).
PAGE 5
M93C86, M93C76, M93C66, M93C56, M93C46 Data Output (Q) when Chip Select Input (S) is driven High. An internal Power-on Data Protection mechanism in the M93Cx6 inhibits the device when the supply is too low. Figure 3. DIP, SO, TSSOP and MLP Connections (Top View) The DU (Don’t Use) pin does not contribute to the normal operation of the device. It is reserved for use by STMicroelectronics during test sequences. The pin may be left unconnected or may be connected to VCC or VSS.
PAGE 6
M93C86, M93C76, M93C66, M93C56, M93C46 MEMORY ORGANIZATION The M93Cx6 memory is organized either as bytes (x8) or as words (x16). If Organization Select (ORG) is left unconnected (or connected to VCC) the x16 organization is selected; when Organization Select (ORG) is connected to Ground (VSS) the x8 organization is selected. When the M93Cx6 is in stand-by mode, Organization Select (ORG) should be set either to VSS or VCC for minimum power consumption.
PAGE 7
M93C86, M93C76, M93C66, M93C56, M93C46 INSTRUCTIONS The instruction set of the M93Cx6 devices contains seven instructions, as summarized in Table 5. to Table 7.. Each instruction consists of the following parts, as shown in Figure 4.: ■ Each instruction is preceded by a rising edge on Chip Select Input (S) with Serial Clock (C) being held Low. ■ A start bit, which is the first ‘1’ read on Serial Data Input (D) during the rising edge of Serial Clock (C).
PAGE 8
M93C86, M93C76, M93C66, M93C56, M93C46 Table 6.
PAGE 9
M93C86, M93C76, M93C66, M93C56, M93C46 Read Erase/Write Enable and Disable The Read Data from Memory (READ) instruction outputs data on Serial Data Output (Q). When the instruction is received, the op-code and address are decoded, and the data from the memory is transferred to an output shift register. A dummy 0 bit is output first, followed by the 8-bit byte or 16bit word, with the most significant bit first. Output data changes are triggered by the rising edge of Serial Clock (C).
PAGE 10
M93C86, M93C76, M93C66, M93C56, M93C46 After the last data bit has been sampled, the Chip Select Input (S) must be taken Low before the next rising edge of Serial Clock (C). If Chip Select Input (S) is brought Low before or after this specific time frame, the self-timed programming cycle will not be started, and the addressed location will not be programmed. The completion of the cycle can be detected by monitoring the Ready/Busy line, as described later in this document.
PAGE 11
M93C86, M93C76, M93C66, M93C56, M93C46 Erase All Write All The Erase All Memory (ERAL) instruction erases the whole memory (all memory bits are set to 1). The format of the instruction requires that a dummy address be provided. The Erase cycle is conducted in the same way as the Erase instruction (ERASE). The completion of the cycle can be detected by monitoring the Ready/Busy line, as described in the READY/BUSY STATUS section.
PAGE 12
M93C86, M93C76, M93C66, M93C56, M93C46 READY/BUSY STATUS When the Write cycle is completed, and Chip Select Input (S) is driven High, the Ready signal (Q=1) indicates that the M93Cx6 is ready to receive the next instruction. Serial Data Output (Q) remains set to 1 until the Chip Select Input (S) is brought Low or until a new start bit is decoded.
PAGE 13
M93C86, M93C76, M93C66, M93C56, M93C46 MAXIMUM RATING Stressing the device above the rating listed in the Absolute Maximum Ratings table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not im- plied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
PAGE 14
M93C86, M93C76, M93C66, M93C56, M93C46 DC AND AC PARAMETERS This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC Characteristic tables that follow are derived from tests performed under the Measure- ment Conditions summarized in the relevant tables. Designers should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parameters. Table 9.
PAGE 15
M93C86, M93C76, M93C66, M93C56, M93C46 Table 12. AC Measurement Conditions (M93Cx6) Symbol CL Parameter Min. Max. Load Capacitance Unit 100 Input Rise and Fall Times pF 50 Input Pulse Voltages ns 0.4 V to 2.4 V V Input Timing Reference Voltages 1.0 V and 2.0 V V Output Timing Reference Voltages 0.8 V and 2.0 V V Note: 1. Output Hi-Z is defined as the point where data out is no longer driven. Table 13. AC Measurement Conditions (M93Cx6-W and M93Cx6-R) Symbol CL Parameter Min. Max.
PAGE 16
M93C86, M93C76, M93C66, M93C56, M93C46 Table 15. DC Characteristics (M93Cx6, Device Grade 6) Symbol Parameter Test Condition Min. Max. Unit 0V ≤VIN ≤VCC ±2.5 µA 0V ≤VOUT ≤VCC, Q in Hi-Z ±2.5 µA VCC = 5V, S = VIH, f = 2 MHz, Q = open 2 mA VCC = 5V, S = VSS, C = VSS, ORG = VSS or VCC 15 µA ILI Input Leakage Current ILO Output Leakage Current ICC Supply Current ICC1 Supply Current (Stand-by) VIL Input Low Voltage VCC = 5V ± 10% –0.45 0.
PAGE 17
M93C86, M93C76, M93C66, M93C56, M93C46 Table 17. DC Characteristics (M93Cx6-W, Device Grade 6) Symbol Parameter ILI Input Leakage Current ILO Output Leakage Current ICC Supply Current (CMOS Inputs) Test Condition Min. Max. Unit 0V ≤VIN ≤VCC ±2.5 µA 0V ≤VOUT ≤VCC, Q in Hi-Z ±2.5 µA VCC = 5V, S = VIH, f = 2 MHz, Q = open 2 mA VCC = 2.5V, S = VIH, f = 2 MHz, Q = open 1 mA 5 µA VCC = 2.5V, S = VSS, C = VSS, ICC1 Supply Current (Stand-by) VIL Input Low Voltage (D, C, S) –0.45 0.
PAGE 18
M93C86, M93C76, M93C66, M93C56, M93C46 Table 18. DC Characteristics (M93Cx6-W, Device Grade 7 or 3) Symbol Max. (1) Unit 0V ≤VIN ≤VCC ±2.5 µA 0V ≤VOUT ≤VCC, Q in Hi-Z ±2.5 µA VCC = 5V, S = VIH, f = 2 MHz, Q = open 2 mA VCC = 2.5V, S = VIH, f = 2 MHz, Q = open 1 mA VCC = 2.5V, S = VSS, C = VSS, ORG = VSS or VCC 5 µA Parameter ILI Input Leakage Current ILO Output Leakage Current ICC Supply Current (CMOS Inputs) Test Condition Min.
PAGE 19
M93C86, M93C76, M93C66, M93C56, M93C46 Table 20. AC Characteristics (M93Cx6, Device Grade 6, 7 or 3) Test conditions specified in Table 12. and Table 9. Symbol Alt. fC fSK tSLCH tSHCH tCSS Parameter Clock Frequency Min. Max. Unit D.C.
PAGE 20
M93C86, M93C76, M93C66, M93C56, M93C46 Table 21. AC Characteristics (M93Cx6-W, Device Grade 6) Test conditions specified in Table 13. and Table 10. Symbol Alt. fC fSK tSLCH Parameter Clock Frequency Min. Max. Unit D.C.
PAGE 21
M93C86, M93C76, M93C66, M93C56, M93C46 Table 22. AC Characteristics (M93Cx6-W, Device Grade 7 or 3) Test conditions specified in Table 13. and Table 10. Symbol Alt. fC fSK tSLCH Parameter Clock Frequency Min. Max. Unit D.C.
PAGE 22
M93C86, M93C76, M93C66, M93C56, M93C46 Table 23. AC Characteristics (M93Cx6-R) Test conditions specified in Table 13. and Table 11. Symbol Alt. fC fSK tSLCH Min.(3) Max.(3) Unit Clock Frequency D.C.
PAGE 23
M93C86, M93C76, M93C66, M93C56, M93C46 Figure 9. Synchronous Timing (Start and Op-Code Input) tCLSH tCHCL C tSHCH tCLCH S tDVCH D tCHDX OP CODE START START OP CODE OP CODE INPUT AI01428 Figure 10. Synchronous Timing (Read or Write) C tCLSL S tDVCH tCHDX A0 An D tSLSH tCHQV tSLQZ tCHQL Hi-Z Q15/Q7 Q ADDRESS INPUT Q0 DATA OUTPUT AI00820C Figure 11.
PAGE 24
M93C86, M93C76, M93C66, M93C56, M93C46 PACKAGE MECHANICAL Figure 12. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Outline E b2 A2 A1 b A L c e eA eB D 8 E1 1 PDIP-B Note: Drawing is not to scale. Table 24. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Mechanical Data millimeters inches Symbol Typ. Min. A Typ. Min. 5.33 A1 Max. 0.210 0.38 0.015 A2 3.30 2.92 4.95 0.130 0.115 0.195 b 0.46 0.36 0.56 0.018 0.014 0.022 b2 1.52 1.14 1.78 0.060 0.045 0.
PAGE 25
M93C86, M93C76, M93C66, M93C56, M93C46 Figure 13. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Outline h x 45˚ A2 A C B ddd e D 8 E H 1 A1 α L SO-A Note: Drawing is not to scale. Table 25. SO8 narrow – 8 lead Plastic Small Outline, 150 mils body width, Package Data millimeters inches Symbol Typ Min Max A 1.35 A1 Min Max 1.75 0.053 0.069 0.10 0.25 0.004 0.010 A2 1.10 1.65 0.043 0.065 B 0.33 0.51 0.013 0.020 C 0.19 0.25 0.007 0.010 D 4.
PAGE 26
M93C86, M93C76, M93C66, M93C56, M93C46 Figure 14. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm², Outline e D b L1 L3 E E2 L A D2 ddd A1 UFDFPN-01 Note: 1. Drawing is not to scale. 2. The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to VSS. It must not be allowed to be connected to any other voltage or signal line on the PCB, for example during the soldering process. Table 26.
PAGE 27
M93C86, M93C76, M93C66, M93C56, M93C46 Figure 15. TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, Package Outline D 8 5 c E1 1 E 4 α A1 A L A2 L1 CP b e TSSOP8BM Note: Drawing is not to scale. Table 27. TSSOP8 3x3mm² – 8 lead Thin Shrink Small Outline, 3x3mm² body size, Mechanical Data millimeters inches Symbol Typ. Min. A Max. Min. 1.100 A1 0.050 0.150 0.750 0.950 b 0.250 c A2 Typ. 0.850 Max. 0.0433 0.0020 0.0059 0.0295 0.0374 0.400 0.0098 0.
PAGE 28
M93C86, M93C76, M93C66, M93C56, M93C46 Figure 16. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Outline D 8 5 c E1 1 E 4 α A1 A L A2 L1 CP b e TSSOP8AM Note: Drawing is not to scale. Table 28. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Mechanical Data millimeters inches Symbol Typ. Min. A 0.050 0.150 0.800 1.050 b 0.190 c 0.090 A2 Typ. Min. 1.200 A1 1.000 CP Max. 0.0472 0.0020 0.0059 0.0315 0.0413 0.300 0.0075 0.0118 0.200 0.0035 0.0079 0.0394 0.
PAGE 29
M93C86, M93C76, M93C66, M93C56, M93C46 PART NUMBERING Table 29. Ordering Information Scheme Example: M93C86 – W MN 6 T P /S Device Type M93 = MICROWIRE serial access EEPROM Device Function 86 = 16 Kbit (2048 x 8) 76 = 8 Kbit (1024 x 8) 66 = 4 Kbit (512 x 8) 56 = 2 Kbit (256 x 8) 46 = 1 Kbit (128 x 8) Operating Voltage blank = VCC = 4.5 to 5.5V W = VCC = 2.5 to 5.5V R = VCC = 1.8 to 5.
PAGE 30
M93C86, M93C76, M93C66, M93C56, M93C46 REVISION HISTORY Table 30. Document Revision History Date Rev. Description of Revision 04-Feb-2003 2.0 Document reformatted, and reworded, using the new template. Temperature range 1 removed. TSSOP8 (3x3mm) package added. New products, identified by the process letter W, added, with fc(max) increased to 1MHz for -R voltage range, and to 2MHz for all other ranges (and corresponding parameters adjusted) 26-Mar-2003 2.
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M93C86, M93C76, M93C66, M93C56, M93C46 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice.