Datasheet
Table Of Contents
- Table 1. Device summary
- 1 Description
- Figure 1. M41T62 logic diagram
- Figure 2. M41T63 logic diagram
- Figure 3. M41T64 logic diagram
- Figure 4. M41T65 logic diagram
- Figure 5. M41T62 connections
- Figure 6. M41T63 connections
- Figure 7. M41T64 connections
- Figure 8. M41T65 connections
- Table 2. Signal names
- Figure 9. M41T62 block diagram
- Figure 10. M41T63 block diagram
- Figure 11. M41T64 block diagram
- Figure 12. M41T65 block diagram
- Figure 13. Hardware hookup for SuperCap™ backup operation
- 2 Operation
- 3 Clock operation
- 3.1 RTC registers
- 3.2 Calibrating the clock
- 3.3 Setting alarm clock registers
- 3.4 Watchdog timer
- 3.5 Watchdog output (WDO - M41T63/65 only)
- 3.6 Square wave output (M41T62/63/64)
- 3.7 Full-time 32 KHz square wave output (M41T64)
- 3.8 Century bits
- 3.9 Leap year
- 3.10 Output driver pin (M41T62/65)
- 3.11 Oscillator stop detection
- 3.12 Initial power-on defaults
- 4 Maximum ratings
- 5 DC and AC parameters
- Table 12. Operating and AC measurement conditions
- Figure 25. AC measurement I/O waveform
- Figure 26. Crystal isolation example
- Table 13. Capacitance
- Table 14. DC characteristics
- Table 15. Crystal electrical characteristics
- Table 16. Crystals suitable for use with M41T6x series RTCs
- Table 17. Oscillator characteristics
- Figure 27. Bus timing requirements sequence
- Table 18. AC characteristics
- 6 Package mechanical information
- Figure 28. QFN16 - 16-pin, quad, flat package, no-lead, 3 mm x 3 mm body size, outline
- Table 19. QFN16 - 16-pin, quad, flat package, no-lead, 3 mm x 3 mm body size, mechanical data
- Figure 29. QFN16 - 16-pin, quad, flat package, no-lead, 3 x 3 mm, recommended footprint
- Figure 30. LCC8 - 8-pin, 1.5 mm x 3.2 mm leadless chip carrier, outline
- Table 20. LCC8 - 8-pin, 1.5 mm x 3.2 mm leadless chip carrier, mechanical data
- Figure 31. LCC8 - 8-pin, 1.5 mm x 3.2 mm leadless chip carrier, recommended footprint
- Figure 32. Carrier tape for QFN16 3 mm x 3 mm package
- Table 21. Carrier tape dimensions for QFN16 3 mm x 3 mm package
- Figure 33. Carrier tape for LCC8 1.5 mm x 3.2 mm package
- Figure 34. Reel schematic
- Table 22. Reel dimensions for 12 mm carrier tape - QFN16 and LCC8 packages
- 7 Part numbering
- 8 Revision history
DocID10397 Rev 20 31/44
M41T62, M41T63, M41T64, M41T65 Maximum ratings
4 Maximum ratings
Stressing the device above the rating listed in the absolute maximum ratings table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
Table 11. Absolute maximum ratings
Sym Parameter Conditions
(1)
1. Test conforms to JEDEC standard.
Value
(2)
2. Data based on characterization results, not tested in production.
Unit
T
STG
Storage temperature (V
CC
off, oscillator off) –55 to 125
°C
V
CC
Supply voltage –0.3 to 5.0 V
T
SLD
(3)
3. Reflow at peak temperature of 260 °C. The time above 255 °C must not exceed 30 seconds.
Lead solder temperature for 10 seconds 260 °C
V
IO
Input or output voltages –0.2 to Vcc+0.3 V
I
O
Output current 20 mA
P
D
Power dissipation 1 W
V
ESD(HBM)
Electro-static discharge voltage
(human body model)
T
A
= 25 °C >1500 V
V
ESD(RCDM)
Electro-static discharge voltage
(robotic charged device model)
T
A
= 25 °C >1000 V