Datasheet

M41ST85W Maximum ratings
Doc ID 7531 Rev 11 29/43
4 Maximum ratings
Stressing the device above the rating listed in the absolute maximum ratings table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the operating sections of
this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality documents.
Table 8. Absolute maximum ratings
Caution: Negative undershoots below –0.3 V are not allowed on any pin while in the battery backup
mode.
Caution: Do NOT wave solder SOIC to avoid damaging SNAPHAT sockets.
Symbol Parameter Value Unit
T
STG
Storage temperature (V
CC
off, oscillator
off)
SNAPHAT
®
–40 to 85 °C
SOIC –55 to 150 °C
T
SLD
Lead solder temperature for 10 seconds
SOH28
(1)
1. For SOH28 package, lead-free (pb-free) lead finish: reflow at peak temperature of 260°C (the time above
255°C must not exceed 30 seconds).
260 °C
SOX28
(2)
2. The SOX28 package has lead-free (pb-free) lead finish, but cannot be exposed to peak reflow temperature
in excess of 240°C. Reflow at peak temperature of 240°C (the time above 235°C must not exceed 20
seconds).
240 °C
V
IO
Input or output voltage –0.3 to V
CC
+0.3 V
V
CC
Supply voltage –0.3 to 4.6 V
I
O
Output current 20 mA
P
D
Power dissipation 1 W