Datasheet

Package mechanical data M24C64-W M24C64-R M24C64-F 
38/42 DocID16891 Rev 28
Figure 21. Thin WLCSP 8-bump wafer-length chip-scale package outline
(M24C64-DFCT6TP/K)
1. Drawing is not to scale.
2. The index on the wafer back side (circle) is above the index of the bump side (triangle/arrow).
Table 23. Thin WLCSP 8-bump wafer-length chip-scale package mechanical data
(M24C64-DFCT6TP/K)
Symbol
millimeters inches
(1)
1. Values in inches are converted from mm and rounded to four decimal digits.
Typ Min Max Typ Min Max
A 0.315 0.300 0.330 0.0124 0.0118 0.0130
A1 0.115 0.0045
A2 0.200 0.0079
b
(2)
2. Dimension measured at the maximum bump diameter parallel to primary datum Z.
0.160 0.0063
D 1.073 1.093 0.0422 0.0430
E 0.959 0.979 0.0378 0.0385
e 0.693 0.0273
e1 0.800 0.0315
e2 0.400 0.0157
F 0.133 0.0052
G 0.137 0.00524
aaa 0.110 0.0043
eee 0.060 0.0043
(4X)
aaa
Wafer back side
D
E
Side view
Detail A
A2
A
e
e2
e1
G
F
Bumps side
F
Detail A
Rotated 90 °
Bump
eee
Seating plane
1Ci_ME_V2
e2
b
X Y
Z
Z
Reference
Orientation
reference
H
A1