Datasheet

DocID16891 Rev 28 37/42
M24C64-W M24C64-R M24C64-F 
41
Figure 20. WLCSP 5-bump wafer-length chip-scale package outline
(M24C64-FCS6TP/K)
1. Drawing is not to scale.
2. The index on the wafer back side (circle) is above the index of the bump side (triangle/arrow).
Table 22. WLCSP 5-bump wafer-length chip-scale package mechanical data
(M24C64-FCS6TP/K)
Symbol
millimeters inches
(1)
1. Values in inches are converted from mm and rounded to four decimal digits.
Typ Min Max Typ Min Max
A 0.545 0.490 0.600 0.0215 0.0193 0.0236
A1 0.190 0.0075
A2 0.355 0.0140
b
(2)
2. Dimension measured at the maximum bump diameter parallel to primary datum Z.
0.270 0.0106
D 0.959 1.074 0.0378 0.0423
E 1.073 1.168 0.0422 0.0460
e 0.693 0.0273
e1 0.400 0.0157
e2 0.3465 0.0136
F 0.280 0.0110
G 0.190 0.0075
aaa 0.110 0.0043
eee 0.060 0.0024
Bump
Detail A
rotated by 90°
Wafer back side
Side view
Detail A
Bump side
A
A2
e1
e2
e
C
B
A
1
23
G
F
A1
D
E
b
1Cd_ME
Index
Index