Datasheet

M24C32-W M24C32-R M24C32-F M24C32-X M24C32-DF Maximum rating
Doc ID 4578 Rev 21 23/40
7 Maximum rating
Stressing the device outside the ratings listed in Ta ble 5 may cause permanent damage to
the device. These are stress ratings only, and operation of the device at these, or any other
conditions outside those indicated in the operating sections of this specification, is not
implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Table 5. Absolute maximum ratings
Symbol Parameter Min. Max. Unit
Ambient operating temperature –40 130 °C
T
STG
Storage temperature –65 150 °C
T
LEAD
Lead temperature during soldering see note
(1)
1. Compliant with JEDEC Std J-STD-020D (for small body, Sn-Pb or Pb assembly), the ST ECOPACK®
7191395 specification, and the European directive on Restrictions on Hazardous Substances (RoHS)
2002/95/EU.
°C
PDIP-specific lead temperature during soldering 260
(2)
2. T
LEAD
max must not be applied for more than 10 s.
°C
V
IO
Input or output range –0.50 6.5 V
I
OL
DC output current (SDA = 0) - 5 mA
V
CC
Supply voltage –0.50 6.5 V
V
ESD
Electrostatic pulse (Human Body model)
(3)
3. Positive and negative pulses applied on different combinations of pin connections, according to AEC-
Q100-002 (compliant with JEDEC Std JESD22-A114, C1=100 pF, R1=1500 Ω).
-4000V