Datasheet

DocID023494 Rev 4 7/38
M24C16-W M24C16-R M24C16-F Description
37
Figure 3. UFDFPN5 package connections
1. See Section 9: Package mechanical data for package dimensions, and how to identify pin 1.
Figure 4. M24C16-FCS5TP/S WLCSP connections (top view, marking side, with balls
on the underside)
Caution: As EEPROM cells lose their charge (and so their binary value) when exposed to ultra violet
(UV) light, EEPROM dice delivered in wafer form or in WLCSP package by
STMicroelectronics must never be exposed to UV light.
MS32117V1
SDA
SCL
WC
1
2
34
V
CC
V
SS
V
SS
5
2
1
2
34
5
2
Top view
(marking side)
Bottom view
(pads side)
ABCD
XYZW
V
CC
WC
SDA
SCL
V
SS
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