Datasheet
Table Of Contents
- 1 Description
- 2 Signal description
- 3 Memory organization
- 4 Device operation
- 5 Instructions
- 6 Initial delivery state
- 7 Maximum rating
- 8 DC and AC parameters
- Table 5. Operating conditions (voltage range W)
- Table 6. Operating conditions (voltage range R)
- Table 7. Operating conditions (voltage range F, for devices identified by process letter T)
- Table 8. Operating conditions (voltage range F, for all other devices)
- Table 9. AC measurement conditions
- Figure 11. AC measurement I/O waveform
- Table 10. Input parameters
- Table 11. Cycling performance
- Table 12. Memory cell data retention
- Table 13. DC characteristics (M24C08-W, device grade 6)
- Table 14. DC characteristics (M24C08-R, device grade 6)
- Table 15. DC characteristics (M24C08-F device)
- Table 16. 400 kHz AC characteristics
- Table 17. 100 kHz AC characteristics (I2C Standard mode)
- Figure 12. Maximum Rbus value versus bus parasitic capacitance (Cbus) for an I2C bus at maximum frequency fC = 400 kHz
- Figure 13. AC waveforms
- 9 Package mechanical data
- Figure 14. TSSOP8 – 8-lead thin shrink small outline, package outline
- Table 18. TSSOP8 – 8-lead thin shrink small outline, package mechanical data
- Figure 15. SO8N – 8-lead plastic small outline, 150 mils body width, package outline
- Table 19. SO8N – 8-lead plastic small outline, 150 mils body width, package data
- Figure 16. PDIP8 – 8-pin plastic DIP, 0.25 mm lead frame, package outline
- Table 20. PDIP8 – 8-pin plastic DIP, 0.25 mm lead frame, package mechanical data
- Figure 17. UFDFPN8 (MLP8) – package outline (UFDFPN: Ultra thin Fine pitch Dual Flat Package, No lead)
- Table 21. UFDFPN8 (MLP8) – package dimensions (UFDFPN: Ultra thin Fine pitch Dual Flat Package, No lead)
- Figure 18. M24C08-FCS5TP/S WLCSP package outline
- Table 22. M24C08-FCS5TP/S WLCSP package data
- Figure 19. Thin M24C08-FCT5TP/S WLCSP package outline
- Table 23. Thin M24C08-FCT5TP/S WLCSP package data
- 10 Part numbering
- 11 Revision history

DocID023924 Rev 3 39/40
M24C08-W M24C08-R M24C08-F Revision history
39
11 Revision history
Table 25. Document revision history
Date Revision Changes
17-Dec-2012 1
New single product M24C08 datasheet resulting from splitting the
previous datasheet M24C08-x M24C04-x M24C02-x M24C01-x
(revision 18) into separate datasheets.
25-Sep-2013 2
Added:
– Table 11: Cycling performance
– Table 7: Operating conditions (voltage range F, for devices
identified by process letter T) and Table 8: Operating conditions
(voltage range F, for all other devices).
Updated:
– Features: supply voltage, write cycles and data retention
– Section 1: Description
– Table 4: Absolute maximum ratings, Table 12: Memory cell data
retention, Table 13: DC characteristics (M24C08-W, device grade
6), Table 14: DC characteristics (M24C08-R, device grade 6),
Table 15: DC characteristics (M24C08-F device), Table 24:
Ordering information scheme
– Figure 13: AC waveforms
Renamed Figure 17 and Table 21.
Replaced “5 bump” by “M24C08-FCT5TP/S” in WLCSP package
description.
17-Dec-2013 3
Added Figure 4: Chip enable inputs connection
Updated:
– Table 13: DC characteristics (M24C08-W, device grade 6)
– Table 14: DC characteristics (M24C08-R, device grade 6)
– Table 15: DC characteristics (M24C08-F device)
– Figure 13: AC waveforms
– Table 24: Ordering information scheme