Datasheet

DocID023994 Rev 3 31/34
M24C04-W M24C04-R M24C04-F Package mechanical data
33
Figure 15. UFDFPN8 (MLP8) – package outline (UFDFPN: Ultra thin Fine pitch
Dual Flat Package, No lead)
1. Drawing is not to scale.
2. The central pad (area E2 by D2 in the above illustration) is internally pulled to V
SS
. It must not be
connected to any other voltage or signal line on the PCB, for example during the soldering process.
Table 21. UFDFPN8 (MLP8) – package dimensions (UFDFPN: Ultra thin Fine pitch
Dual Flat Package, No lead)
Symbol
millimeters inches
(1)
1. Values in inches are converted from mm and rounded to four decimal digits.
Typ Min Max Typ Min Max
A 0.550 0.450 0.600 0.0217 0.0177 0.0236
A1 0.020 0.000 0.050 0.0008 0.0000 0.0020
b 0.250 0.200 0.300 0.0098 0.0079 0.0118
D 2.000 1.900 2.100 0.0787 0.0748 0.0827
D2 (rev MC) – 1.200 1.600 – 0.0472 0.0630
E 3.000 2.900 3.100 0.1181 0.1142 0.1220
E2 (rev MC) – 1.200 1.600 – 0.0472 0.0630
e 0.500 – – 0.0197 – –
K (rev MC) – 0.300 – – 0.0118 –
L – 0.300 0.500 – 0.0118 0.0197
L1 – – 0.150 – – 0.0059
L3 – 0.300 – – 0.0118 –
eee
(2)
2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from
measuring.
– 0.080 – – 0.0031 –
D
E
ZW_MEeV2
A
A1
eee
L1
e b
D2
L
E2
L3
Pin 1
K
MC