Datasheet

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M24C16, M24C08, M24C04, M24C02, M24C01
Figure 15. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm²,
Outline
Note: 1. Drawing is not to scale.
2. The central pad (the area E2 by D2 in the above illustration) is pulled, internally, to V
SS
. It must not be allowed to be connected to
any other voltage or signal line on the PCB, for example during the soldering process.
3. The circle in the top view of the package indicates the position of pin 1.
Table 17. UFDFPN8 (MLP8) 8-lead Ultra thin Fine pitch Dual Flat Package No lead 2x3mm²,
Data
Symbol
millimeters inches
Typ. Min. Max. Typ. Min. Max.
A 0.55 0.50 0.60 0.022 0.020 0.024
A1 0.00 0.05 0.000 0.002
b 0.25 0.20 0.30 0.010 0.008 0.012
D 2.00 0.079
D2 1.55 1.65 0.061 0.065
ddd 0.05 0.002
E 3.00 0.118
E2 0.15 0.25 0.006 0.010
e0.50– 0.020
L 0.45 0.40 0.50 0.018 0.016 0.020
L1 0.15 0.006
L3 0.30 0.012
N (number of
pins)
88
D
E
UFDFPN-01
A
A1
ddd
L1
e
b
D2
L
E2
L3