Datasheet

13/24
M24512
MAXIMUM RATING
Stressing the device outside the ratings listed in
Table 7. may cause permanent damage to the de-
vice. These are stress ratings only, and operation
of the device at these, or any other conditions out-
side those indicated in the Operating sections of
this specification, is not implied. Exposure to Ab-
solute Maximum Rating conditions for extended
periods may affect device reliability. Refer also to
the STMicroelectronics SURE Program and other
relevant quality documents.
Table 7. Absolute Maximum Ratings
Note: 1. Compliant with JEDEC Std J-STD-020C (for small body, Sn-Pb or Pb assembly), the ST ECOPACK
®
7191395 specification, and
the European directive on Restrictions on Hazardous Substances (RoHS) 2002/95/EU
2. AEC-Q100-002 (compliant with JEDEC Std JESD22-A114A, C1=100pF, R1=1500Ω, R2=500Ω)
Symbol Parameter Min. Max. Unit
T
A
Ambient Operating Temperature –40 125 °C
T
STG
Storage Temperature –65 150 °C
T
LEAD
Lead Temperature during Soldering
See note
(1)
°C
V
IO
Input or Output range –0.50 6.5 V
V
CC
Supply Voltage –0.50 6.5 V
V
ESD
Electrostatic Discharge Voltage (Human Body model)
2
–4000 4000 V