M24512 512 Kbit Serial I²C Bus EEPROM FEATURES SUMMARY ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Two-Wire I2C Serial Interface Supports 400 kHz Protocol Supply Voltage Ranges: – 1.8V to 5.5V (M24512 − R) – 2.5V to 5.5V (M24512 − W) Write Control Input BYTE and PAGE WRITE (up to 128 Bytes) RANDOM and SEQUENTIAL READ Modes Self-Timed Programming Cycle Automatic Address Incrementing Enhanced ESD/Latch-Up Protection More than 100,000 Erase/Write Cycles More than 40-Year Data Retention Figure 1. Packages 8 1 PDIP8 (BN) Table 1.
M24512 TABLE OF CONTENTS FEATURES SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 1. M24512 devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Figure 1. Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Figure 2. Logic Diagram . . . . . . . . . . . . . . . . . . .
M24512 DC AND AC PARAMETERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Table 8. Operating Conditions (M24512 – W) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Table 9. Operating Conditions (M24512 – R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Table 10. AC Measurement Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
M24512 SUMMARY DESCRIPTION 2 These I C-compatible electrically erasable programmable memory (EEPROM) devices are organized as 64K x 8 bits. Figure 2. Logic Diagram VCC 3 E0-E2 SCL SDA M24512 WC VSS AI02275 Table 2. Signal Names E0, E1, E2 Chip Enable SDA Serial Data SCL Serial Clock WC Write Control VCC Supply Voltage VSS Ground I2C uses a two-wire serial interface, comprising a bi-directional data line and a clock line.
M24512 SIGNAL DESCRIPTION Serial Clock (SCL). This input signal is used to strobe all data in and out of the device. In applications where this signal is used by slave devices to synchronize the bus to a slower clock, the bus master must have an open drain output, and a pull-up resistor must be connected from Serial Clock (SCL) to VCC. (Figure 4. indicates how the value of the pull-up resistor can be calculated).
M24512 Figure 5. I2C Bus Protocol SCL SDA SDA Input START Condition SCL 1 2 SDA MSB SDA Change STOP Condition 3 7 8 9 ACK START Condition SCL 1 SDA MSB 2 3 7 8 9 ACK STOP Condition AI00792B Table 3. Device Select Code Device Type Identifier1 Device Select Code Chip Enable Address2 RW b7 b6 b5 b4 b3 b2 b1 b0 1 0 1 0 E2 E1 E0 RW Note: 1. The most significant bit, b7, is sent first. 2.
M24512 DEVICE OPERATION The device supports the I2C protocol. This is summarized in Figure 5.. Any device that sends data on to the bus is defined to be a transmitter, and any device that reads the data to be a receiver. The device that controls the data transfer is known as the bus master, and the other as the slave device. A data transfer can only be initiated by the bus master, which will also provide the serial clock for synchronization. The M24512 device is always a slave in all communication.
M24512 Figure 6. Write Mode Sequences with WC=1 (data write inhibited) WC ACK BYTE ADDR ACK BYTE ADDR NO ACK DATA IN STOP DEV SEL START BYTE WRITE ACK R/W WC ACK DEV SEL START PAGE WRITE ACK BYTE ADDR ACK BYTE ADDR NO ACK DATA IN 1 DATA IN 2 R/W WC (cont'd) NO ACK DATA IN N STOP PAGE WRITE (cont'd) NO ACK AI01120C Write Operations Following a Start condition the bus master sends a Device Select Code with the Read/Write bit (RW) reset to 0.
M24512 data starts to become overwritten in an implementation dependent way. The bus master sends from 1 to 128 bytes of data, each of which is acknowledged by the device if Write Control (WC) is Low. If Write Control (WC) is High, the contents of the addressed memory location are not modified, and each data byte is followed by a NoAck. After each byte is transferred, the internal byte address counter (the 7 least significant address bits only) is incremented.
M24512 Figure 8.
M24512 Figure 9.
M24512 Sequential Read This operation can be used after a Current Address Read or a Random Address Read. The bus master does acknowledge the data byte output, and sends additional clock pulses so that the device continues to output the next byte in sequence. To terminate the stream of bytes, the bus master must not acknowledge the last byte, and must generate a Stop condition, as shown in Figure 9.
M24512 MAXIMUM RATING Stressing the device outside the ratings listed in Table 7. may cause permanent damage to the device. These are stress ratings only, and operation of the device at these, or any other conditions outside those indicated in the Operating sections of this specification, is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality documents. Table 7.
M24512 DC AND AC PARAMETERS This section summarizes the operating and measurement conditions, and the DC and AC characteristics of the device. The parameters in the DC and AC Characteristic tables that follow are derived from tests performed under the Measure- ment Conditions summarized in the relevant tables. Designers should check that the operating conditions in their circuit match the measurement conditions when relying on the quoted parameters. Table 8.
M24512 Table 11. Input Parameters Symbol Parameter(1,2) Test Condition Min. Max. Unit CIN Input Capacitance (SDA) 8 pF CIN Input Capacitance (other pins) 6 pF ZL(3) Input Impedance (E2, E1, E0, WC) VIN < 0.3VCC 30 kΩ ZH(3) Input Impedance (E2, E1, E0, WC) VIN > 0.7VCC 500 kΩ Pulse width ignored (Input Filter on SCL and SDA) Single glitch tNS 100 ns Note: 1. TA = 25 °C, f = 400 kHz 2. Sampled only, not 100% tested. 3.
M24512 Table 14. AC Characteristics (M24512 – W) Symbol Alt. Parameter Min. Max.
M24512 Figure 11.
M24512 PACKAGE MECHANICAL Figure 12. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Outline E b2 A2 A1 b A L c e eA eB D 8 E1 1 PDIP-B Note: Drawing is not to scale. Table 16. PDIP8 – 8 pin Plastic DIP, 0.25mm lead frame, Package Mechanical Data millimeters inches Symbol Typ Min A Typ Min 5.33 A1 Max 0.210 0.38 0.015 A2 3.30 2.92 4.95 0.130 0.115 0.195 b 0.46 0.36 0.56 0.018 0.014 0.022 b2 1.52 1.14 1.78 0.060 0.045 0.070 c 0.25 0.20 0.36 0.010 0.008 0.
M24512 Figure 13. SO8W – 8 lead Plastic Small Outline, 208 mils body width, Package Outline A2 A C B CP e D N E H 1 A1 α L SO-b Note: Drawing is not to scale. Table 17. SO8W – 8 lead Plastic Small Outline, 208 mils body width, Package Mechanical Data millimeters inches Symbol Typ Min A Max Typ Min 2.03 A1 0.10 A2 0.080 0.25 0.004 1.78 B 0.35 0.45 – – D 5.15 E Max 0.010 0.070 0.014 0.018 – – 5.35 0.203 0.211 5.20 5.40 0.205 0.213 – – – – H 7.70 8.
M24512 Figure 14. SO8N – 8 lead Plastic Small Outline, 150 mils body width, Package Outline h x 45˚ A2 A C B ddd e D 8 E H 1 A1 α L SO-A Note: Drawing is not to scale. Table 18. SO8N – 8 lead Plastic Small Outline, 150 mils body width, Package Mechanical Data millimeters inches Symbol Typ Min Max A 1.35 A1 Min Max 1.75 0.053 0.069 0.10 0.25 0.004 0.010 A2 1.10 1.65 0.043 0.065 B 0.33 0.51 0.013 0.020 C 0.19 0.25 0.007 0.010 D 4.80 5.00 0.189 0.197 ddd 0.
M24512 Figure 15. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Outline D 8 5 c E1 1 E 4 α A1 A L A2 L1 CP b e TSSOP8AM Note: Drawing is not to scale. Table 19. TSSOP8 – 8 lead Thin Shrink Small Outline, Package Mechanical Data millimeters inches Symbol Typ Min A Max Min 1.200 A1 0.050 0.150 0.800 1.050 b 0.190 c 0.090 A2 Typ 1.000 CP Max 0.0472 0.0020 0.0059 0.0315 0.0413 0.300 0.0075 0.0118 0.200 0.0035 0.0079 0.0394 0.100 0.0039 D 3.000 2.900 3.
M24512 PART NUMBERING Table 20. Ordering Information Scheme Example: M24512 – W MW 6 T P Device Type M24 = I2C serial access EEPROM Device Function 512 = 512 Kbit (64K x 8) Operating Voltage W = VCC = 2.5 to 5.5V R = VCC = 1.8 to 5.5V Package BN = PDIP8 MW = SO8 (208 mil width) MN = SO8 (150 mil body width) DW = TSSOP8 Device Grade 6 = Industrial temperature range, –40 to 85 °C.
M24512 REVISION HISTORY Table 21. Document Revision History Date Revision Description of Revision 29-Jan-2001 1.1 Lead Soldering Temperature in the Absolute Maximum Ratings table amended Write Cycle Polling Flow Chart using ACK illustration updated LGA8 and SO8(wide) packages added References to PSDIP8 changed to PDIP8, and Package Mechanical data updated 10-Apr-2001 1.2 LGA8 Package Mechanical data and illustration updated SO16 package removed 16-Jul-2001 1.
M24512 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice.
This datasheet has been download from: www.datasheetcatalog.com Datasheets for electronics components.
