Datasheet

M24512-W M24512-R M24512-DR M24512-DF Revision history
Doc ID 16459 Rev 26 39/40
11 Revision history
Table 23. Document revision history
Date Revision Changes
31-Jan-2011 22
Updated Ta bl e 7, Ta bl e 1 3 , Ta b l e 16 and Ta b l e 17 .
Added note
(2)
to Ta bl e 14 .
Deleted Table 22: Available M24512-W and M24512-R products
(package, voltage range, temperature grade) and Table 23: Available
M24512-DR products (package, voltage range, temperature grade).
01-Mar-2012 23
Deleted reference “M24512-DR” and inserted reference “M24512-DF”.
Updated data regarding package UFDFPN8.
Updated Section 1: Description.
Added Figure 4 and updated title of Figure 3.
Updated V
ESD
value in Table 7: Absolute maximum ratings, note
(1)
under Ta bl e 1 3 and I
CC
value in Tabl e 14 .
Added Table 10: Operating conditions (voltage range F) and Table 15:
DC characteristics (voltage range F).
Added values t
WLDL
and t
DHWH
in Table 16: 400 kHz AC characteristics
and Table 17: 1 MHz AC characteristics.
–Replaced Figure 14.
12-Apr-2012 24 Updated Section 1: Description.
25-Jun-2012 25
Datasheet split into:
M24512-125 datasheet for automotive products (range 3),
M24512-W M24512-R M24512-DR M24512-DF for standard products
(range 6, this datasheet rev 25).
Deleted:
–SO8W package
UFDFPN8 (MLP8): MB version package
WLCSP (KA die) dimensions
Added:
Reference M24512-DR
Table 11: Cycling performance by groups of four bytes
Table 12: Memory cell data retention
Updated:
Figure 12: Maximum Rbus value versus bus parasitic capacitance
(Cbus) for an I2C bus at maximum frequency fC = 400 kHz
Figure 13: Maximum Rbus value versus bus parasitic capacitance
Cbus) for an I2C bus at maximum frequency fC = 1MHz
17-Sep-2012 26
Updated Section 5.2.2: Current Address Read.
Modified Figure 3: WLCSP connections for the M24512-DFCS6TP/K (top
view, marking side, with balls on the underside) and Figure 18: M24512-
DFCS6TP/K, WLCSP 8-bump wafer-level chip scale package outline.