Datasheet

M24512-W M24512-R M24512-DR M24512-DF Package mechanical data

Doc ID 16459 Rev 26 35/40

Figure 17. UFDFPN8 (MLP8) - 8-lead ultra thin fine pitch dual flat no lead, package

outline

1. Drawing is not to scale.

2. The central pad (area E2 by D2 in the above illustration) is internally pulled to V

. It must not be

connected to any other voltage or signal line on the PCB, for example during the soldering process.

Table 20. UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead

2 x 3 mm, data

Symbol

millimeters inches

(1)

1. Values in inches are converted from mm and rounded to four decimal digits.

Typ Min Max Typ Min Max

A 0.550 0.450 0.600 0.0217 0.0177 0.0236

A1 0.020 0.000 0.050 0.0008 0.0000 0.0020

b 0.250 0.200 0.300 0.0098 0.0079 0.0118

D 2.000 1.900 2.100 0.0787 0.0748 0.0827

D2 (rev MC) 1.200 1.600 0.0472 0.0630

E 3.000 2.900 3.100 0.1181 0.1142 0.1220

E2 (rev MC) 1.200 1.600 0.0472 0.0630

e 0.500 0.0197

K (rev MC) 0.300 0.0118

L 0.300 0.500 0.0118 0.0197

L1 0.150 0.0059

L3 0.300 0.0118

eee

(2)

2. Applied for exposed die paddle and terminals. Exclude embedding part of exposed die paddle from

measuring.

0.080 0.0031

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