Datasheet

M24256-BW M24256-BR M24256-BF M24256-DR M24256-DF Revision history
Doc ID 6757 Rev 30 39/40
16-Nov-2011 25
Updated UFDFPN8 silhouette on cover page, Figure 16: UFDFPN8
(MLP8) 8-lead ultra thin fine pitch dual flat package no lead 2 x 3 mm,
outline and Table 21: UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual
flat package no lead 2 x 3 mm, mechanical data to add MC version.
22-Jun-2012 26
Datasheet revision 25 split into:
– M24256-125 datasheet for automotive products (range 3),
– M24256-BW M24256-BR M24256-BF M24256-DR M24256-DF (this
datasheet) for standard products (range 6).
Added:
– Reference M24256-DF
– Table 1: Signal names, Table 12: Memory cell data retention
Updated:
– Table 16: 400 kHz AC characteristics and Table 17: 1 MHz AC
characteristics: added set up and hold timing conditiions on WC
(t
WLDL
and t
DHWH
)
– Figure 18: M24256-DFCS6TP/K, WLCSP 8-bump wafer-level chip
scale package outline and Table 21: M24256-DFCS6TP/K, WLCSP 8-
bump wafer-level chip scale package mechanical data
– Cycling and data retention limits
Deleted:
– UFDFPN8, package revision MB
01-Aug-2012 27
Updated Figure 3: WLCSP connections for the M24256-DFCS6TP/K (top
view, marking side, with balls on the underside) and Figure 18: M24256-
DFCS6TP/K, WLCSP 8-bump wafer-level chip scale package outline.
18-Sep-2012 28
Changed title of Figure 3: WLCSP connections for the M24256-
DFCS6TP/K (top view, marking side, with balls on the underside).
Updated Section 5.2.2: Current Address Read.
20-Nov-2012 29 Corrected “Device family” data in Table 22: Ordering information scheme.
17-Dec-2012 30
Deleted note (3) under Table 2: Device select code.
Modified I
CCO
condition in Table 14: DC characteristics (M24256-BR,
M24256-DR, device grade 6).
Deleted incorrect table (Table 15. DC characteristics (M24256-R, device
grade 6)).
Updated package list in Table 22: Ordering information scheme.
Table 23. Document revision history (continued)
Date Revision Changes