Datasheet

LNBH23 Maximum ratings
Doc ID 13356 Rev 8 11/32
4 Maximum ratings
Note: 1 Absolute maximum ratings are those values beyond which damage to the device may occur.
These are stress ratings only and functional operation of the device at these conditions is
not implied. Exposure to absolute-maximum-rated conditions for extended periods may
affect device reliability. All voltage values are with respect to network ground terminal.
2 The BYP pin is intended only to connect an external ceramic capacitor. Any connection of
this pin to external current or voltage sources may cause permanent damage to the device.
Table 3. Absolute maximum ratings
Symbol Parameter Value Unit
V
CC-L
, V
CC
DC power supply input voltage pins -0.3 to 16 V
V
UP
DC input voltage -0.3 to 24 V
I
O
Output current Internally Limited mA
V
oRX
DC output pin voltage -0.3 to 25 V
V
oTX
Tone output pin voltage -0.3 to 25 V
V
I
Logic input voltage (TTX, SDA, SCL, DSQIN, EXTM, VCTRL,
ADDR)
-0.3 to 7 V
LX LX input voltage -0.3 to 24 V
V
DETIN
Detector input signal amplitude 2 V
PP
V
OH
Logic high output voltage (DSQOUT) -0.3 to 7 V
V
BYP
Internal reference pin voltage ( Note 2 ) -0.3 to 4.6 V
ISEL Current selection pin voltage -0.3 to 4.6 V
T
STG
Storage temperature range -50 to 150 °C
T
J
Operating junction temperature range -25 to 125 °C
ESD
ESD rating with human body model (HBM) for all pins unless
6, 19, 20 (for PSSO24) and unless 4, 21, 22 (for QFN32)
2
kV
ESD rating with human body model (HBM) for pins 19, 20 (for
PSSO24) and pins 21, 22 (for QFN32)
4
ESD rating with human body model (HBM) for pin 6 (for
PSSO24) and pin 4 (for QFN32)
0.6
Table 4. Thermal data
Symbol Parameter QFN32 PowerSSO-24 Unit
R
thJC
Thermal resistance junction-case 2 2 °C/W
R
thJA
Thermal resistance junction-ambient (PowerSSO-
24) with device soldered on 2s2p PC Board
35 30 °C/W