Datasheet

L99MC6 Package and PCB thermal data
Doc ID 16523 Rev 2 49/32
Equation 1 represents Δ T
j-amb
calculation of a full loaded device for the HSD1 junction.
Equation 1
Table 48. Auto and mutual thermal resistance - 8 cm
2
of Cu heatsink
HSD 1 HSD 2 HSD 3 LSD 4 LSD 5 LSD 6
HSD 1 46.51 43.16 41.49 45.19 43.06 42.08
HSD 2 43.16 46.51 41.49 43.06 45.19 43.06
HSD 3 41.49 41.49 46.51 42.08 43.06 45.19
LSD 4 45.19 43.06 42.08 47.19 46.31 45.19
LSD 5 43.06 45.19 43.06 46.31 47.19 46.31
LSD 5 42.08 43.06 45.19 45.19 46.31 47.19
661551441
331221111
LSDLSD,HSDLSDLSD,HSDLSDLSD,HSD
HSDHSD,HSDHSDHSD,HSDHSDHSDHSD
PdRthPdRthPdRth
PdRthPdRthPdRthT
∗+∗+∗+
+∗+∗+∗=Δ