Datasheet

Package and PCB thermal data L99MC6
48/32 Doc ID 16523 Rev 2
12 Package and PCB thermal data
12.1 PowerSSO-16 thermal data
Figure 22. PowerSSO-16 PC board
(1)
1. Layout condition of thermal resistance measurements (PCB: double layer, thermal vias,
FR4 area = 77 mm x 86 mm, PCB thickness =1.6 mm, Cu thickness = 70 µm (front and back side) thermal
vias separation 1.2 mm, thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 25 µm,
footprint dimension 2.5 mm x 4.2 mm ).
Table 46. Auto and mutual thermal resistance - footprint
HSD 1 HSD 2 HSD 3 LSD 4 LSD 5 LSD 6
HSD 1 89.57 85.83 84.41 88.89 87.06 85.84
HSD 2 85.83 89.57 84.41 87.06 88.89 87.06
HSD 3 84.41 84.41 89.57 85.84 87.06 88.89
LSD 4 88.89 87.06 85.84 93.58 90.54 89.08
LSD 5 87.06 88.89 87.06 90.54 93.58 90.54
LSD 5 85.84 87.06 88.89 89.08 90.54 93.58
Table 47. Auto and mutual thermal resistance - 2 cm
2
of Cu heatsink
HSD 1 HSD 2 HSD 3 LSD 4 LSD 5 LSD 6
HSD 1
59.96 55.06 54.23 58.25 56.08 54.71
HSD 2 55.06 59.96 54.23 56.08 58.25 56.08
HSD 3 54.23 54.23 59.96 54.71 56.08 58.25
LSD 4 58.25 56.08 54.71 61.80 60.37 59.45
LSD 5 56.08 58.25 56.08 60.37 61.80 60.37
LSD 5 54.71 56.08 58.25 59.45 60.37 61.80
.