L99MC6 Configurable 6-channel device Features ■ 3 independently self configuring high-/low-side channels ■ 3 low-side channels ■ RON = 0.7 Ω (typ) at Tj = 25 °C ■ Current limit of each output at min. 0.
Contents L99MC6 Contents 1 2 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1.1 Application diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 1.2 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.1 Dual power supply: VS and VCC . . .
L99MC6 8 Contents 7.2 AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 7.3 Dynamic characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 7.4 SPI timing parameter definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Functional description of the SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 8.1 8.2 9 Signal description . . . . . . . . . . . . . . . . . . .
Contents 13 L99MC6 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 13.1 ECOPACK® . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 13.2 PowerSSO-16 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 13.3 Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52 Appendix A Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . .
L99MC6 List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Table 22. Table 23. Table 24. Table 25. Table 26. Table 27. Table 28. Table 29. Table 30. Table 31. Table 32. Table 33. Table 34. Table 35. Table 36. Table 37. Table 38. Table 39. Table 40. Table 41. Table 42. Table 43. Table 44. Table 45. Table 46. Table 47. Table 48.
List of tables Table 49. Table 50. Table 51. 6/32 L99MC6 PowerSSO-16 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
L99MC6 List of figures List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Application diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Introduction L99MC6 1 Introduction 1.1 Application diagram Figure 1. Application diagram VBat Active reverse polarity protection VREG Charge Pump Driver and Protections OL Config. OUT1 Vcc PWM / IN Driver and Protections M OL Config. OUT2 Driver and Protections CONTROL LOGIC OL Config.
L99MC6 Introduction 1.2 Block diagram and pin description Figure 2.
Introduction Table 2. 10/32 L99MC6 Pin functions Pin Symbol Function 1 / TAB GND 6 IN/PWM IN/PWM direct mode: Direct input for channel 2. Other channels can be driven in PWM mode via SPI. 8 VCC Logic voltage supply 3.
L99MC6 Introduction Figure 3.
Description L99MC6 2 Description 2.1 Dual power supply: VS and VCC The supply voltage VCC (3.3 V/5 V) supplies the whole device. In case of power-on (VCC increases from undervoltage to VPOR OFF = 2.7 V, typical) the circuit is initialized by an internally generated power-on reset (POR). If the voltage VCC decreases under the minimum threshold (VPOR ON = 2.4 V, typical), the outputs are switched-off (highimpedance) and the status registers are cleared (see Figure 4). Figure 4.
L99MC6 2.2 Description Standby mode The standby mode of the L99MC6 is activated by SPI command (EN bit of CTRL 0 reset to 0, see Section 9.3.2: Register description). The inputs and outputs are switched-off. The status registers are cleared and the control registers are reset to their default values. In the standby mode the current consumption is 5 µA (typical value). A SPI command is needed to switch the L99MC6 in normal mode. 2.3 Inductive loads Each switch is built by a power DMOS transistor.
Description 2.4.1 L99MC6 Direct input IN/PWM The IN/PWM input allows channel 2 to be enabled without the use of SPI. The IN/PWM pin is OR-ed with the SPI command bit. This pin can be left open if the channel 2 is controlled only via the SPI. This input has an internal pull-down. The IN/PWM signal can also be applied to any other switches by the activation of the PWM mode. This input is suited for non-inductive loads that are pulse width modulated. This allows PWM control without further use of the SPI.
L99MC6 Description The following combination must be used: channel 1 + 4, channel 2 + 5, channel 3 + 6 (Figure 6). A VS voltage exceeding the low-side clamping voltage (VDRN_CL1-6) , while the high one of the high-side drivers is turned on, may cause a destruction of the device. Caution: In bridge mode using channels 2 and 5, the IN/PWM pin has to be grounded. Therefore PWM mode on other channels is not possible. Figure 6.
Description 2.7 L99MC6 Bulb mode (programmable soft start function to drive loads with higher inrush current) Loads with start-up currents higher than the overcurrent limits (for example inrush current of lamps, start current of motors and cold resistance of heaters) can be driven by using the programmable soft start function (that is overcurrent recovery mode). Each driver has a corresponding overcurrent recovery bit.
L99MC6 3 Absolute maximum ratings Absolute maximum ratings Stressing the device above the rating listed in Table 3 may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ESD protection 4 L99MC6 ESD protection Table 4. ESD protection Parameter Value Unit All pins ±2(1) kV Output pins: DRN1 – DRN6; SRC1, SRC3, SRC5 ±4(2) kV Machine model (CDF-AEC-Q100-03 rev. F) ±200 V Charged device model (CDF-AEC-Q100-011 Rev. F) ±1500 V 1. HBM according to MIL 883C, Method 3015.7 or EIA/JESD22-A114-A 2.
L99MC6 Thermal data 5 Thermal data 5.1 Temperature warning and thermal shutdown Table 5. Temperature warning and thermal shutdown Item Symbol Parameter Min. 5.2.1 TjTW ON Temperature warning threshold junction temperature Tj increasing 5.2.2 TjTW OFF Temperature warning threshold junction temperature Tj decreasing 5.2.3 TjTW HYS Temperature warning hysteresis 5.2.4 TjSD ON Thermal shutdown threshold junction temperature Tj increasing 5.2.
Electrical characteristics 6 L99MC6 Electrical characteristics VS = 6 V to 16 V, VCC = 3.0 V to 5.3 V, Tj = -40 °C to 150 °C, unless otherwise specified. The voltages are referred to GND and currents are assumed positive, when the current flows into the pin. 6.1 Supply Table 6. Supply Item Symbol 6.1.1 VS 6.1.2 6.1.3 6.1.4 IS IVS VCC 6.1.5 ICC 6.1.6 Parameter Test condition Max. Unit 28 V 1.5 2.
L99MC6 Electrical characteristics 6.3 Channels Table 8. Channels Item 6.3.1 6.3.2 6.3.3 Symbol rON SWI1-3 rON SWI1-6 ISC1-6 Parameter Test condition On resistance drain to source in HS configuration On resistance drain to source or GND, in LS configuration Overcurrent protection Min. Typ. Max. Unit VS=13.5 V, Tj = 25 °C, CP on, Iload = 250 mA - 700 900 mΩ VS=13.5 V, Tj = 125 °C, CP on, Iload = 250 mA - 1100 1500 mΩ VS = 6.
Electrical characteristics Table 8. L99MC6 Channels (continued) Item Symbol Parameter Min. Typ. Max. Unit 6.3.10 IQLS Switched-off output current SRC 1-3 - -15 -25 µA 6.3.11 VOLD1-6 Drain open-load detection voltage on drain 1,1 2,0 2,5 V 6.3.12 IOLD1-6 Open-load detection current on drain 80 190 280 µA 6.3.13 VOLS1-3 Source open-load detection voltage on source 1,1 2,0 2,5 V 6.3.14 IOLS1-3 Open-load detection current on source @ VOLS -80 -190 -280 µA 6.3.
L99MC6 7 SPI electrical characteristics SPI electrical characteristics VS = 6 V to 16 V, VCC = 3.0 V to 5.3 V, Tj = -40 °C to 150 °C, unless otherwise specified. The voltages are referred to GND and currents are assumed positive, when the current flows into the pin 7.1 DC characteristics Table 9. DC characteristics Symbol Parameter Test condition Min Typ Max Unit 0.3VDD V DI, SCK, CSN, PWM VIL Low-level input voltage - VIH High-level input voltage - 0.
SPI electrical characteristics L99MC6 7.3 Dynamic characteristics Table 11.
L99MC6 SPI electrical characteristics 7.4 SPI timing parameter definition Figure 8. Serial input timing tHCSN CSN tCSNQV tCSNQT Data out Data out SDO t SCKQV tSCSN t SSCK SCK t SSDI SDI Figure 9.
SPI electrical characteristics L99MC6 Figure 10.
L99MC6 Functional description of the SPI 8 Functional description of the SPI 8.1 Signal description 8.1.1 Serial clock (SCK) This input signal provides the timing of the serial interface. Data present at serial data input (SDI) is latched on the rising edge of serial clock (SCK). Data on serial data output (SDO) is shifted out at the falling edge of serial clock (see Figure 11).
Functional description of the SPI L99MC6 Figure 12.
L99MC6 Functional description of the SPI 8.2 SPI communication flow 8.2.1 General description The proposed SPI communication is based on a standard SPI interface structure using CSN (chip select not), SDI (serial data in), SDO (serial data out/error) and SCK (serial clock) signal lines. At the beginning of each communication the master reads the register (ROM address 3EH) of the slave device.
Functional description of the SPI L99MC6 Operating code definition Table 15. Operating code definition OC1 OC0 Meaning 0 0 0 1 1 0 1 1 The and operations allow access to the RAM of the device, that is write to control registers or read status information.
L99MC6 Functional description of the SPI Table 17. Bit Global status register description (continued) Description Polarity Comment 6 Communication error Active high Bit is set if the number of clock cycles during CSN = low does not match with the specified frame width or if an invalid bus condition is detected (DI always 1). DI always 0 automatically leads to clearing the enable bit in CTRL0 and is not signaled as communication error.
Functional description of the SPI L99MC6 For Read operations, the bit in the is set, but the register to be read is still transferred to the DO pin. If the number of clock cycles is smaller than the frame width, the data at DO is truncated. If the number of clock cycles is larger than the frame width, the data at DO is filled with ‘0’ bits. Due to this safety functionality a daisy chaining of SPI is not possible.
L99MC6 8.5 Functional description of the SPI Read and Clear Status operation OC0, OC1: operating code (10 for ‘Read and Clear Status’ mode) Table 20. Command byte for Read and Clear Status operation MSB LSB Operating code 1 0 Address A5 A4 A3 A2 A1 A0 The ‘Read and Clear Status’ operation starts with a command byte followed by 1 data byte. The content of the data byte is ‘do not care’.
SPI control and status register L99MC6 9 SPI control and status register 9.1 RAM memory map Table 22. 9.
L99MC6 Table 25. SPI control and status register Control register 1 Data Byte Adress Access Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Channel 2&5 control 01h R/W Default Table 26. ENCP CH5 [2] CH5 [1] CH5 [0] Bridge 2&5 CH2 [2] CH2 [1] CH2 [0] 1 0 0 0 0 0 0 0 Bit 3 Bit 2 Bit 1 Bit 0 Control register 2 Data Byte Adress Access Bit 7 Bit 6 Bit 5 Bit 4 Channel 1&4 control 02h R/W Default Table 27.
SPI control and status register L99MC6 9.3.1 Channel configuration decoding Table 29. Channel configuration decoding CHx CHx CHx [2] [1] [0] PWM mode Overcurrent recovery (1) CHx Slew Rate Open-load detection 0 0 0 Off No - High Off 1 1 1 Off(1) No - Low On 0 0 1 On No No High - 0 1 0 On No No Low - 0 1 1 On No Yes Low - 1 0 1 IN/PWM(2) Yes No High Off 0 IN/PWM(2) Yes No Low On 1 1 1.
L99MC6 SPI control and status register 9.4 Examples 9.4.1 Example 1:Switch on channel 1 It is assumed that the charge pump is already activated (ENCP1 = 1 and DISCP2 = 0, POR default) Table 31. Command byte - example 1 MSB LSB Operating code 0 Table 32. Address 0 0 0 0 0 1 0 Data byte - example 1 MSB LSB 0 0 0 0 0 0 0 1 From Table 31 and Table 32 follow that the value 01h is written at RAM address 02h (control register 2).
SPI control and status register 9.4.2 L99MC6 Example 2: Bridge mode configuration Table 34. Command byte 1 - example 2 MSB LSB Operating code 0 Table 35. Address 0 0 0 0 0 0 1 Data byte 1 - example 2 MSB LSB 1 0 1 0 1 0 0 0 From Table 34 and Table 35 follow that the value A8h is written at RAM address 01h (control register 1). Table 36 describe more in detail the data byte structure. Table 36.
L99MC6 SPI control and status register Table 39.
SPI control and status register 9.4.3 L99MC6 Example 3: Open-load detection in off-state in bridge configuration Table 40. Command byte 1 - example 3 MSB LSB Operating code 0 Table 41. Address 0 0 0 0 0 0 1 Data byte 1 - example 3 MSB LSB 1 1 1 1 1 0 0 0 From Table 40 and Table 41 follow that the value F8h is written at RAM address 01h (control register 1). Table 42 describe more in detail the data byte structure. Table 42.
L99MC6 SPI control and status register Table 45.
Maximum demagnetization energy 10 L99MC6 Maximum demagnetization energy Figure 16. Configurable switch HSD - maximum turn-off current versus inductance 1 A B I (A) C 0.
L99MC6 Maximum demagnetization energy Figure 17. Configurable switch LSD - maximum turn-off current versus inductance 1 A B I (A) C 0.
Maximum demagnetization energy L99MC6 Figure 18. Fixed LSD switch - maximum turn-off current versus inductance 1 A I (A) B C 0.
L99MC6 11 Application examples Application examples Figure 19.
Application examples L99MC6 Figure 20.
L99MC6 Application examples Figure 21.
Package and PCB thermal data L99MC6 12 Package and PCB thermal data 12.1 PowerSSO-16 thermal data Figure 22. PowerSSO-16 PC board(1) . 1. Layout condition of thermal resistance measurements (PCB: double layer, thermal vias, FR4 area = 77 mm x 86 mm, PCB thickness =1.6 mm, Cu thickness = 70 µm (front and back side) thermal vias separation 1.2 mm, thermal via diameter 0.3 mm +/- 0.08 mm, Cu thickness on vias 25 µm, footprint dimension 2.5 mm x 4.2 mm ). Table 46.
L99MC6 Package and PCB thermal data Table 48. Auto and mutual thermal resistance - 8 cm2 of Cu heatsink HSD 1 HSD 2 HSD 3 LSD 4 LSD 5 LSD 6 HSD 1 46.51 43.16 41.49 45.19 43.06 42.08 HSD 2 43.16 46.51 41.49 43.06 45.19 43.06 HSD 3 41.49 41.49 46.51 42.08 43.06 45.19 LSD 4 45.19 43.06 42.08 47.19 46.31 45.19 LSD 5 43.06 45.19 43.06 46.31 47.19 46.31 LSD 5 42.08 43.06 45.19 45.19 46.31 47.
Package and packing information L99MC6 13 Package and packing information 13.1 ECOPACK® In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 13.2 PowerSSO-16 package information Figure 23.
L99MC6 Package and packing information PowerSSO-16 mechanical data(1) Table 49. Millimeters Symbol Min. Typ. Max. A 1.25 - 1.72 A1 0.00 - 0.10 A2 1.10 - 1.62 B 0.18 - 0.36 C 0.19 - 0.25 (2) 4.80 - 5.00 E 3.80 - 4.00 e - 0.50 - H 5.80 - 6.20 h 0.25 - 0.50 L 0.40 - 1.27 k 0d - 8d X 1.90 - 2.50 Y 3.60 - 4.20 - 0.10 D ddd 1. Drawings dimensions include single and matrix versions. 2.
Package and packing information 13.3 L99MC6 Packing information Figure 24. PowerSSO-16 tube shipment (no suffix) B Base Q.ty Bulk Q.ty Tube length (± 0.5) A B C (± 0.1) C A 100 2000 532 1.85 6.75 0.6 All dimensions are in mm. Figure 25. PowerSSO-16 tape and reel shipment (suffix “TR”) REEL DIMENSIONS Base q.ty Bulk q.ty A (max) B (min) C (± 0.2) F G (+ 2 / -0) N (min) T (max) 2500 2500 330 1.5 13 20.2 12.4 60 18.
L99MC6 Acronyms Appendix A Acronyms Table 50.
Revision history L99MC6 Revision history Table 51. 54/32 Document revision history Date Revision Changes 18-Nov-2009 1 Initial release. 20-Sep-2013 2 Updated disclaimer.
L99MC6 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale.
