Datasheet

DocID15567 Rev 6 47/53
L99H01 Package and packing information
52
6.3 Packages thermal data
Figure 14. LQFP32 R
thj-amb
vs. PCB copper area in open box free air condition
1. Layout condition of Rth and Zth measurements (PCB: double layer, thermal vias,
FR4 area = 78 mm x 86 mm, PCB thickness =1.6 mm, Cu thickness =70 µm (front and back side), copper
areas: from minimum pad layout to 8 cm
2
).
75
76
77
78
79
80
81
0 0.2 0.4 0.6 0.8 1
RTHj_amb(°C/W)
PCB Cu heatsink area (cm^2)