Datasheet

DocID15567 Rev 6 43/53
L99H01 Packages thermal data
52
5 Packages thermal data
Figure 12. PowerSSO-36 R
thj-amb
vs. PCB copper area in open free air condition
1. Layout condition of R
th
and Z
th
measurements (PCB: double layer, thermal vias,
FR4 area = 129 mm x 60 mm, PCB thickness =1.6 mm, Cu thickness =70 µm (front and back side),
Copper areas: from minimum pad layout to 8 cm
2
).
35
40
45
50
55
60
65
0246810
RTHj_amb(°C/W)
PCB Cu heatsink area (cm^2)