Datasheet

Pin description and connection diagrams L6738A
10/32 Doc ID 18134 Rev 2
2.2 Thermal data
8COMP
Error amplifier output.
Connect with an R
F
- C
F
to FB. The device cannot be disabled by grounding this pin.
9FB
Error amplifier inverting input.
Connect with a resistor R
FB
to VSEN and with an R
F
- C
F
to COMP.
10 VSEN
Output voltage monitor.
It manages OVP and UVP protections and PGOOD. Connect to the positive side of the
load for remote sensing. See Section 6 for details.
11 FBG
Remote ground sense.
Connect to the negative side of the load for remote sensing.
12 CSN
Current sense negative input.
Connect to the output-side of the main inductor. Filter with 100 nF (Typ.) to GND.
13 CSP
Current sense positive input.
Connect through an R-C filter to the phase-side of the main inductor.
14 OSC
OSC: Internally set to 1.24 V, it allows programming the switching frequency F
SW
of the
device. Switching frequency can be increased according to the resistor R
OSC
connected
to SGND with a gain of 10 kHz/µA (see Section 7 for details). If floating, the switching fre-
quency is 200 kHz.
15 VCC
Device power supply. The embedded bootstrap diode is internally connected to this pin.
Operative voltage is 5 V to 12 V bus. Filter with 1 µF MLCC to GND.
For proper operations, VCC needs to be >1.5 V higher than the programmed V
OUT
.
16 GND
All internal references, logic and driver return path are referenced to this pin. Connect to
the PCB GND ground plane and filter to VCC and VCCDR.
Thermal
PA D
The thermal pad connects the silicon substrate and makes good thermal contact with the
PCB. Use VIAs to connect to the PGND plane.
Table 2. Pin description (continued)
Pin# Name Function
Table 3. Thermal data
Symbol Parameter Value Unit
R
THJA
Thermal resistance junction to ambient
(Device soldered on 2s2p PC Board)
45 °C/W
R
THJC
Thermal resistance junction to case 1 °C/W
T
MAX
Maximum junction temperature 150 °C
T
STG
Storage temperature range -40 to 150 °C
T
J
Junction temperature range -40 to 125 °C